CAT24C64_16 Datasheet, PDF (15/16 Pages) ON Semiconductor – 64 Kb I2C CMOS Serial EEPROM

CAT24C64
PACKAGE DIMENSIONS
E
ÈÈ ^{PIN A1}
REFERENCE
AB
D
WLCSP4, 0.76x0.76
CASE 567PB
ISSUE O
TOP VIEW
DETAIL A
A2
0.05 C
NOTE 6
DIE COAT
(OPTIONAL)
A3
A2
A
0.05 C
NOTE 4 _A1
SIDE VIEW
NOTE 3
C
SEATING
PLANE
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DATUM C, THE SEATING PLANE, IS DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
4. COPLANARITY APPLIES TO SPHERICAL CROWNS OF
THE SOLDER BALLS.
5. DIMENSION b IS MEASURED AT THE MAXIMUM
CONTACT BALL DIAMETER PARALLEL TO DATUM C.
6. BACKSIDE COATING IS OPTIONAL.
MILLIMETERS
DIM MIN NOM MAX
A
−−−
−−− 0.30
A1 0.04 0.055 0.07
A2
0.19 REF
A3
0.025 REF
b 0.15 0.155 0.16
D 0.71 0.76 0.81
E 0.71 0.76 0.81
e
0.40 BSC
NOTE 5
4X b
0.05 C A B
B
0.03 C
A
e
e
12
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
1
A
PACKAGE
OUTLINE
0.40
PITCH
4X
0.16
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
15