CAV25512_16 Datasheet, PDF (13/14 Pages) ON Semiconductor – 512-Kb SPI Serial CMOS EEPROM

CAV25512
PACKAGE DIMENSIONS
E
PIN A1
ÈÈÈÈ ^REFERENCE
2X
0.03 C
2X
0.03 C
TOP VIEW
0.10 C
0.05 C
NOTE 3 _A1
SIDE VIEW
e/2
e
8X b
0.05 C A B
C
0.03 C
NOTE 4
B
A
12345
BOTTOM VIEW
WLCSP8, 1.36x1.99
CASE 567MB
ISSUE O
AB
D
A2
A
C
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
4. DIMENSION b IS MEASURED AT THE MAXIMUM
BALL DIAMETER PARALLEL TO DATUM C.
MILLIMETERS
DIM MIN MAX
A
−−− 0.60
A1 0.16 0.22
A2
0.35 REF
b 0.22 0.32
D
1.36 BSC
E
1.99 BSC
e
0.50 BSC
e1
0.433 BSC
RECOMMENDED
SOLDERING FOOTPRINT*
A1
PACKAGE
OUTLINE
e1
0.433
PITCH
0.50
PITCH
0.25
PITCH
8X
0.27
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
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