CAV24C512 Datasheet, PDF (12/13 Pages) ON Semiconductor – 512 kb I2C CMOS Serial EEPROM

CAV24C512
PACKAGE DIMENSIONS
PIN A1
REFERENCE
E
ÈÈÈÈ
2X
0.10 C
2X
0.10 C
TOP VIEW
0.10 C
AB
WLCSP8, 1.39x1.65
CASE 567JL
ISSUE B
D
A2
A
0.08 C
NOTE 3
A1
SIDE VIEW
C
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
4. DATUM C, THE SEATING PLANE, IS DEFINED
BY THE SPHERICAL CROWNS OF THE SOL-
DER BALLS.
5. DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER PARALLEL TO DA-
TUM C.
MILLIMETERS
DIM MIN MAX
A
−−− 0.60
A1 0.16 0.22
A2
0.35 REF
b 0.22 0.32
D
1.39 BSC
E
1.65 BSC
e
0.50 BSC
e1
0.433 BSC
8X b
0.05 C A B
0.03 C
e/2
C
B
A
e
e1
12 3 45
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
0.500
PITCH
A1
0.433
PITCH
PACKAGE
OUTLINE
0.25
PITCH
8X
0.27
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
12