AX8052F100 Datasheet, PDF (12/34 Pages) ON Semiconductor – Ultra-Low Power Microcontroller

12 Specifications
4.2. DC Characteristics
Supplies
SYMBOL DESCRIPTION
CONDITION
MIN TYP MAX UNIT
TAMB
Operational ambient
temperature
-40 27
85
°C
VDD_IO
I/O and voltage
regulator supply voltage
1.8 3.0 3.6
V
VDDIO_R1
I/O voltage ramp for
reset activation; Note 1
Ramp starts at VDD_IO≤0.1V
0.1
V/ms
VDDIO_R2
I/O voltage ramp for
reset activation; Note 1
Ramp starts at 0.1V<VDD_IO<0.7V
3.3
V/ms
VBOUT
Brown-out Threshold
Note 2
1.3
V
IDEEPSLEEP
Deep Sleep current
50
nA
ISLEEP256PIN
Sleep current, 256 Bytes
RAM retained
Wakeup from dedicated pin
450
nA
ISLEEP256
Sleep current, 256 Bytes
RAM retained
Wakeup Timer running at 640 Hz
850
nA
ISLEEP4K
Sleep current, 4.25
kBytes RAM retained
Wakeup Timer running at 640 Hz
1.5
μA
ISLEEP8K
Sleep current, 8.25
kBytes RAM retained
Wakeup Timer running at 640 Hz
2.2
μA
IMCU
Micro-controller Running
Power consumption
All peripherals disabled
μA/
150
MHz
IVSUP
Voltage Supervisor
Run and Standby mode
85
μA
IXTALOSC
Crystal oscillator current 20 MHz
160
μA
ILFXTALOSC
Low Frequency Crystal
Oscillator current
32 kHz
700
nA
IRCOSC
Internal Oscillator
current
20 MHz
210
μA
ILPOSC
Internal Low Power
Oscillator current
10 kHz
640 Hz
650
nA
210
nA
IADC
ADC current
311 kSample/s, DMA 5 MHz
1.1
mA
Notes
1. 1. If VDD_IO ramps cannot be guaranteed, an external reset circuit is recommended, see the AX8052 Application Note: Power On Reset
2. Digital circuitry is functional down to typically 1V
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AX8052F100