MC78LC00_16 Datasheet, PDF (11/12 Pages) ON Semiconductor – Micropower Voltage Regulator

MC78LC00 Series
PACKAGE DIMENSIONS
TSOP−5 (SOT23−5)
NTR SUFFIX
CASE 483
ISSUE M
NOTE 5
2X 0.10 T
2X
0.20 T _B ⁵
4
1 23
B
G
A
A
TOP VIEW
D 5X
0.20 C A B
S
M
K
DETAIL Z
C
0.05
H
SIDE VIEW
C
SEATING
PLANE
DETAIL Z
J
END VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
MILLIMETERS
DIM MIN MAX
A 2.85 3.15
B 1.35 1.65
C 0.90 1.10
D 0.25 0.50
G
0.95 BSC
H 0.01 0.10
J 0.10 0.26
K 0.20 0.60
M
0 _{_} 10 _{_}
S 2.50 3.00
SOLDERING FOOTPRINT*
0.95
0.037
1.9
0.074
2.4
0.094
1.0
0.039
0.7
0.028
ǒ Ǔ _{SCALE 10:1}
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
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