CM1402 Datasheet, PDF (11/12 Pages) California Micro Devices Corp – SIM Card EMI Filter Array with ESD Protection

CM1402
CSP Mechanical Specifications
CM1402 devices are packaged in a custom Chip Scale Package (CSP). Dimensions are presented
below. For complete information on CSP packaging, see the California Micro Devices CSP Package
Information document.
Controlling dimension: millimeters
PACKAGE DIMENSIONS
Package
Bumps
Custom CSP
10
Millimeters
Dim
Inches
Min Nom Max Min Nom Max
A1 ^{1.915 1.960 2.005 0.0754 0.0772 0.0789}
A2 ^{1.285 1.330 1.375 0.0506 0.0524 0.0541}
B1 ^{0.495 0.500 0.505 0.0195 0.0197 0.0199}
B2 ^{0.245 0.250 0.255 0.0096 0.0098 0.0100}
B3 ^{0.430 0.435 0.440 0.0169 0.0171 0.0173}
B4 ^{0.430 0.435 0.440 0.0169 0.0171 0.0173}
C1 ^{0.180 0.230 0.280 0.0071 0.0091 0.0110}
C2 ^{0.180 0.230 0.280 0.0071 0.091 0.0110}
D1 ^{0.575 0.644 0.714 0.0226 0.0254 0.0281}
D2 ^{0.368 0.419 0.470 0.0145 0.0165 0.0185}
# per tape and
reel
3500 pieces
BOTTOM VIEW
A1
C1
B2
B1
C
B
A
1234
0.30 DIA.
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
D1
D2
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for CM1402
Chip Scale Package
Rev. 3 | Page 11 of 12 | www.onsemi.com