CM1440 Datasheet, PDF (10/12 Pages) Allegro MicroSystems – 6 Channel EMI Filter Array with ESD Protection

CM1440
Mechanical Details
CSP Mechanical Specifications
CM1440 devices are supplied in a custom Chip Scale Package (CSP). Dimensions are presented below. For
complete information on CSP packaging, see the California Micro Devices CSP Package Information
document.
PACKAGE DIMENSIONS
Package
Bumps
Custom CSP
15
Millimeters
Dim
Inches
Min Nom Max Min Nom Max
A1 ^{2.3150 2.3600 2.4050 0.911 0.0929 0.0947}
A2 ^{1.008 1.053 1.098 0.0397 0.0415 0.0432}
B1 ^{0.395 0.4000 0.405 0.0156 0.0157 0.0159}
B2 ^{0.195 0.2000 0.205 0.0076 0.0078 0.0080}
B3 ^{0.3415 0.3465 0.3515 0.0134 0.0136 0.0138}
B4 ^{0.3415 0.3465 0.3515 0.0134 0.0136 0.0138}
C1 ^{0.130 0.1800 0.230 0.0051 0.0071 0.0091}
C2 ^{0.130 0.1800 0.230 0.0051 0.0071 0.0091}
D1 ^{0.575 0.644 0.714 0.0226 0.0254 0.0281}
D2 ^{0.368 0.419 0.470 0.0145 0.0165 0.0185}
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
0.25 DIA.
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
Package Dimensions for
CM1440 Chip Scale Package
Rev. 3 | Page 10 of 12 | www.onsemi.com