UMZ1NT1G_16 Datasheet, PDF (1/5 Pages) ON Semiconductor – Complementary Dual General Purpose Amplifier Transistor

UMZ1NT1G
Complementary Dual
General Purpose
Amplifier Transistor
PNP and NPN Surface Mount
Features
• High Voltage and High Current: V_CEO = 50 V, I_C = 200 mA
• High h_FE: h_FE = 200X400
• Moisture Sensitivity Level: 1
• ESD Rating − Human Body Model: 3A
ESD Rating − Machine Model: C
• NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC-Q101
Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (T_A = 25°C)
Rating
Symbol
Value
Unit
Collector−Base Voltage
V_(BR)CBO
60
Collector−Emitter Voltage
V_(BR)CEO
50
Emitter−Base Voltage
V_(BR)EBO
7.0
Collector Current − Continuous
I_C
200
THERMAL CHARACTERISTICS
Vdc
Vdc
Vdc
mAdc
Characteristic
(One Junction Heated)
Symbol
Max
Unit
Total Device Dissipation
T_A = 25°C
Derate above 25°C
P_D
187 (Note 1) mW
256 (Note 2)
1.5 (Note 1) mW/°C
2.0 (Note 2)
Thermal Resistance, Junction-to-Ambient
R_qJA
670 (Note 1) °C/W
490 (Note 2)
Characteristic
(Both Junctions Heated)
Symbol
Max
Unit
Total Device Dissipation
T_A = 25°C
Derate above 25°C
P_D
250 (Note 1) mW
385 (Note 2)
2.0 (Note 1) mW/°C
3.0 (Note 2)
Thermal Resistance, Junction-to-Ambient
R_qJA
493 (Note 1) °C/W
325 (Note 2)
Thermal Resistance, Junction-to-Lead
R_qJL
188 (Note 1) °C/W
208 (Note 2)
Junction and Storage Temperature
T_J, T_stg − 55 to +150 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−4 @ Minimum Pad
2. FR−4 @ 1.0 x 1.0 inch Pad
www.onsemi.com
(6)
(5)
(4)
Q₁
Q₂
(1)
(2)
(3)
1
SC−88
CASE 419B
MARKING DIAGRAM
3Z MG
G
1
3Z = Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping^†
UMZ1NT1G
SC−88
(Pb−Free)
3000 /
Tape & Reel
NSVUMZ1NT1G SC−88
(Pb−Free)
3000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2010
September, 2016 − Rev. 9
Publication Order Number:
UMZ1NT1/D