UMZ1NT1G Datasheet, PDF (1/5 Pages) ON Semiconductor – Complementary Dual General Purpose Amplifier Transistor

UMZ1NT1G
Complementary Dual
General Purpose
Amplifier Transistor
PNP and NPN Surface Mount
Features
• High Voltage and High Current: V_CEO = 50 V, I_C = 200 mA
• High h_FE: h_FE = 200X400
• Moisture Sensitivity Level: 1
• ESD Rating − Human Body Model: 3A
ESD Rating − Machine Model: C
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
http://onsemi.com
(6)
(5)
(4)
Q₁
Q₂
(1)
(2)
(3)
MAXIMUM RATINGS (T_A = 25°C)
Rating
Symbol
Value
Unit
Collector−Base Voltage
V_(BR)CBO
60
Collector−Emitter Voltage
V_(BR)CEO
50
Emitter−Base Voltage
V_(BR)EBO
7.0
Collector Current − Continuous
I_C
200
THERMAL CHARACTERISTICS
Vdc
Vdc
Vdc
mAdc
Characteristic
(One Junction Heated)
Symbol
Max
Unit
Total Device Dissipation
T_A = 25°C
Derate above 25°C
P_D
187 (Note 1) mW
256 (Note 2)
1.5 (Note 1) mW/°C
2.0 (Note 2)
Thermal Resistance, Junction-to-Ambient
R_qJA
670 (Note 1) °C/W
490 (Note 2)
Characteristic
(Both Junctions Heated)
Symbol
Max
Unit
Total Device Dissipation
T_A = 25°C
Derate above 25°C
P_D
250 (Note 1) mW
385 (Note 2)
2.0 (Note 1) mW/°C
3.0 (Note 2)
Thermal Resistance, Junction-to-Ambient
R_qJA
493 (Note 1) °C/W
325 (Note 2)
Thermal Resistance, Junction-to-Lead
R_qJL
188 (Note 1) °C/W
208 (Note 2)
Junction and Storage Temperature
T_J, T_stg − 55 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 @ Minimum Pad
2. FR−4 @ 1.0 x 1.0 inch Pad
1
SC−88
CASE 419B
MARKING DIAGRAM
3Z M G
G
1
3Z = Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device*
Package
Shipping^†
UMZ1NT1G
SC−88
(Pb−Free)
3000 /
Tape & Reel
*The “T1” suffix refers to a 7 inch reel.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2010
December, 2010 − Rev. 8
Publication Order Number:
UMZ1NT1/D