ULLGA8 Datasheet, PDF (1/2 Pages) ON Semiconductor – MECHANICAL CASE OUTLINE

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
1
SCALE 8:1
ULLGA8, 1.6x1.0, 0.4P
CASE 613AB-01
ISSUE A
DATE 08 FEB 2008
D
A
B
ÏÏÏ _{PIN ONE}
REFERENCE
ÏÏÏÏÏÏ _{0.10 C}
E
0.10 C
TOP VIEW
0.05 C
8X
0.05 C
SIDE VIEW
A1
A
SEATING
PLANE
C
e/2
1
L1
e
7X L NOTE 4
4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
MILLIMETERS
DIM MIN MAX
A --- 0.40
A1 0.00 0.05
b 0.15 0.25
D 1.60 BSC
E 1.00 BSC
e 0.40 BSC
L 0.25 0.35
L1 0.30 0.40
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
7X
0.49
8X
0.26
1.24
8
5
BOTTOM VIEW
8X b
0.10 C A B
0.05 C NOTE 3
1
0.53 _PKG
OUTLINE
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98AON24010D
Electronic versions are uncontrolled except when
STATUS: ON SEMICONDUCTOR STANDARD
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
NEW STANDARD:
“CONTROLLED COPY” in red.
©Ă Semiconductor Components Industries, LLC, 2002
http://onsemi.com
October, 2D0E0S2 C- ReIPv.T0ION: ULLGA8, 1.6X1.0, 0.4P
1
Case Outline Number:
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