TLV271SN2T1G Datasheet, PDF (1/12 Pages) ON Semiconductor – Single-Channel, Rail-to-Rail Output, 3 MHz BW Operational Amplifier

TLV271
Single-Channel, Rail-to-Rail
Output, 3 MHz BW
Operational Amplifier
The TLV271 operational amplifier provides rail−to−rail output
operation. The output can swing within 320 mV to the positive rail and
50 mV to the negative rail. This rail−to−rail operation enables the user
to make optimal use of the entire supply voltage range while taking
advantage of 3 MHz bandwidth. The TLV271 can operate on supply
voltage as low as 2.7 V over the temperature range of −40°C to 105°C.
The high bandwidth provides a slew rate of 2.4 V/ms while only
consuming 550 mA of quiescent current. Likewise the TLV271 can run
on a supply voltage as high as 16 V making it ideal for a broad range of
battery−operated applications. Since this is a CMOS device it has high
input impedance and low bias currents making it ideal for interfacing
to a wide variety of signal sensors. In addition it comes in a small
TSOP−5 package with two pinout styles allowing for use in
high−density PCB’s.
Features
• Rail−To−Rail Output
• Wide Bandwidth: 3 MHz
• High Slew Rate: 2.4 V/ms
• Wide Power−Supply Range: 2.7 V to 16 V
• Low Supply Current: 550 mA
• Low Input Bias Current: 45 pA
• Wide Temperature Range: −40°C to 105°C
• Small Package: 5 Pin TSOP−5 (same as SOT23−5)
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
• Notebook Computers
• Portable Instruments
http://onsemi.com
5
1
TSOP−5
(SOT23−5)
SN SUFFIX
CASE 483
MARKING
DIAGRAM
5
XXXAYWG
G
1
A
= Assembly Location
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
OUT 1
5 V_EE
V_DD 2
+−
IN+ 3
4 IN−
Style 1 Pinout (SN1T1)
(Top View)
OUT 1
5 V_DD
V_EE 2
+−
IN+ 3
4 IN−
Style 2 Pinout (SN2T1)
(Top View)
ORDERING INFORMATION
Device
Package
Shipping^†
TLV271SN1T1G
(Style 1 Pinout)
TSOP−5
(Pb−Free)
3000 /
Tape & Reel
TLV271SN2T1G
(Style 2 Pinout)
TSOP−5
(Pb−Free)
3000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2013
1
April, 2013 − Rev. 3
Publication Order Number:
TLV271/D