SZNUP2301MW6T1G Datasheet, PDF (1/4 Pages) ON Semiconductor – Low Capacitance Diode Array for ESD Protection in Two Data Lines

NUP2301MW6T1G,
SZNUP2301MW6T1G
Low Capacitance Diode
Array for ESD Protection in
Two Data Lines
NUP2301MW6T1G is a micro−integrated device designed to
provide protection for sensitive components from possible harmful
electrical transients; for example, ESD (electrostatic discharge).
Features
 Low Capacitance (2.0 pf Maximum Between I/O Lines)
 Single Package Integration Design
 Provides ESD Protection for JEDEC Standards JESD22
Machine Model = Class C
Human Body Model = Class 3B
 Protection for IEC61000−4−2 (Level 4)
8.0 kV (Contact)
15 kV (Air)
 Ensures Data Line Speed and Integrity
 Fewer Components and Less Board Space
 Direct the Transient to Either Positive Side or to the Ground
 SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
 This is a Pb−Free Device*
Applications
 T1/E1 Secondary IC Protection
 T3/E3 Secondary IC Protection
 HDSL, IDSL Secondary IC Protection
 Video Line Protection
 Microcontroller Input Protection
 Base Stations
 I²C Bus Protection
http://onsemi.com
SC−88
CASE 419B
STYLE 23
PIN CONFIGURATION
AND SCHEMATIC
V_N 1
I/O 2
6 N/C
5 I/O
V_P 3
4 N/C
MARKING DIAGRAM
6
68 M
1
68 = Specific Device Code
M = Date Code
ORDERING INFORMATION
Device
Package
NUP2301MW6T1G
SC−88
(Pb−Free)
SZNUP2301MW6T1G SC−88
(Pb−Free)
Shipping^†
3,000 /
Tape & Reel
3,000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2012
1
February, 2012 − Rev. 5
Publication Order Number:
NUP2301MW6T1/D