SRDA3.3-4 Datasheet, PDF (1/7 Pages) Semtech Corporation – RailClamp® Low Capacitance TVS Array

SRDA3.3-4
Low Capacitance Surface
Mount TVS for High-Speed
Data Interfaces
The SRDA3.3−4 transient voltage suppressor is designed to protect
equipment attached to high speed communication lines from ESD and
lightning.
Features
• Protects 4 I/O Lines
• Low Working Voltage: 3.3 V
• Low Clamping Voltage
• Low Capacitance (<15 pF) for High Speed Interfaces
• Peak Power − 500 W 8x20 ms
• Transient Protection for High Speed Lines to:
IEC61000−4−2 (ESD) ±15 kV (air), ±8 kV (contact)
IEC61000−4−4 (EFT) 40 A
IEC61000−4−5 (Lightning) 25 A
• UL Flammability Rating of 94 V−0
• This is a Pb−Free Device
Typical Applications
• High Speed Communication Line Protection
• T1/E1 Secondary Protection
• T3/E3 Secondary Protection
• Analog Video Protection
• Base Stations
• I²C Bus Protection
MAXIMUM RATINGS
Rating
Symbol Value
Unit
Peak Power Dissipation
8 x 20 mS @ T_A = 25°C (Note 1)
P_pk
500
W
Junction and Storage Temperature Range T_J, T_stg −55 to +150 °C
Lead Solder Temperature −
Maximum 10 Seconds Duration
T_L
260
°C
IEC 61000−4−2
Contact ESD
±8
kV
Air
±15
IEC 61000−4−4 (5/50 ns)
EFT
40
A
IEC 61000−4−5 (8 x 20 ms)
−
25
A
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Non−repetitive current pulse 8 x 20 mS exponential decay waveform
Pin 2/3 to Pin 5/8
http://onsemi.com
SO−8 LOW CAPACITANCE
VOLTAGE SUPPRESSOR
500 WATTS PEAK POWER
3.3 VOLTS
PIN CONFIGURATION
AND SCHEMATIC
I/O 1 1
REF 1 2
REF 1 3
I/O 2 4
8 GND
7 I/O 4
6 I/O 3
5 GND
8
1
SOIC−8
CASE 751
PLASTIC
MARKING DIAGRAM
8
P4106
AYWWG
G
1
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping^†
SRDA3.3−4DR2G SO−8 2500/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2009
1
November, 2009 − Rev. 0
Publication Order Number:
SRDA3.3−4/D