SMQA2000T1G Datasheet, PDF (1/15 Pages) ON Semiconductor – FINAL PRODUCT/PROCESS CHANGE NOTIFICATION

FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
29-Oct-2009
SUBJECT: ON Semiconductor Final Product/Process Change Notification #16352
TITLE: Copper Wire replacing Gold Wire in the SOT23, SC59, SC70, SC74, SC75 and SC88
Packages
PROPOSED FIRST SHIP DATE: 01-Feb-2010
AFFECTED CHANGE CATEGORY(S): ON Semiconductor Assembly Areas – Wire Bond
AFFECTED PRODUCT DIVISION(S): Small Signal Transistor Business Unit, and ESD and
Protection Business Unit
FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION:
Contact your local ON Semiconductor Sales Office or Eben Lim <[e-mail]>
SAMPLES: Contact your local ON Semiconductor Sales Office or Eben Lim
<[e-mail]>
ADDITIONAL RELIABILITY DATA: Available
Contact your local ON Semiconductor Sales Office or Chui Har Teo <[e-mail] >
NOTIFICATION TYPE:
Final Product/Process Change Notification (FPCN)
Final change notification sent to customers. FPCNs are issued at least 90 days prior to implementation
of the change.
ON Semiconductor will consider this change approved unless specific conditions of acceptance are
provided in writing within 30 days of receipt of this notice. To do so, contact your local ON
Semiconductor Sales Office.
DESCRIPTION AND PURPOSE:
ON Semiconductor is notifying customers of its use of Copper Wire (in place of Gold Wire) for
their SOT23, SC59, SSC70, SC74, SC75, and SC88 packages. Discrete products built with
general purpose transistor, biased-resistor transistor, high voltage transistor, zener diode,
schottky diode, and switching diode platforms are represented by this Process Change
Notice.
Reliability Qualification and full electrical characterization over temperature has been
performed.
Issue Date: 29-Oct-2009
Rev.14 Jun 2007
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