SMMBTA92LT1G Datasheet, PDF (1/4 Pages) ON Semiconductor – High Voltage Transistors PNP Silicon

MMBTA92L, SMMBTA92L,
MMBTA93L
High Voltage Transistors
PNP Silicon
Features
• S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating
Symbol 92
93
Unit
Collector −Emitter Voltage
Collector −Base Voltage
Emitter −Base Voltage
Collector Current — Continuous
DEVICE MARKING
V_CEO
V_CBO
V_EBO
I_C
−300 −200
−300 −200
−5.0 −5.0
−500
Vdc
Vdc
Vdc
mAdc
MMBTA92L, SMMBTA92L = 2D; MMBTA93LT1 = 2E
THERMAL CHARACTERISTICS
Characteristic
Symbol Max
Unit
Total Device Dissipation FR−5 Board
(Note 1) T_A = 25°C
Derate above 25°C
P_D
225
mW
1.8
mW/°C
Thermal Resistance, Junction to Ambient
Total Device Dissipation (Note 2)
Alumina Substrate,⁽²⁾ T_A = 25°C
Derate above 25°C
R_qJA
P_D
556
°C/W
300
mW
2.4
mW/°C
Thermal Resistance, Junction to Ambient R_qJA
Junction and Storage Temperature
T_J, T_stg
417
−55 to
+150
°C/W
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 x 0.75 x 0.062 in.
2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.
http://onsemi.com
COLLECTOR
3
1
BASE
2
EMITTER
3
MARKING
DIAGRAM
1
2
SOT−23 (TO−236AF)
CASE 318
STYLE 6
2x MG
G
2x = Specific Device Code
M = Date Code*
G = Pb−Free Package
(*Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping^†
MMBTA92LT1G SOT−23 3000 / Tape & Reel
(Pb−Free)
SMMBTA92LT1G SOT−23 3000 / Tape & Reel
(Pb−Free)
MMBTA92LT3G SOT−23 10000 / Tape & Reel
(Pb−Free)
SMMBTA92LT3G SOT−23 10000 / Tape & Reel
(Pb−Free)
MMBTA93LT1G SOT−23 3000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2013
1
January, 2013 − Rev. 10
Publication Order Number:
MMBTA92LT1/D