SMMBD914LT1G Datasheet, PDF (1/4 Pages) ON Semiconductor – High-Speed Switching Diode

MMBD914LT1G,
SMMBD914LT1G,
MMBD914LT3G,
SMMBD914LT3G
High-Speed Switching
Diode
Features
 AEC−Q101 Qualified and PPAP Capable
 S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
 These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
MAXIMUM RATINGS
Rating
Reverse Voltage
Forward Current
Peak Forward Surge Current
THERMAL CHARACTERISTICS
Symbol
V_R
I_F
I_FM(surge)
Value
100
200
500
Unit
Vdc
mAdc
mAdc
Characteristic
Total Device Dissipation
FR−5 Board (Note 1)
T_A = 25C
Derate above 25C
Symbol
P_D
Max
225
1.8
Unit
mW
mW/C
Thermal Resistance, Junction−to−Ambient
Total Device Dissipation
Alumina Substrate (Note 2)
T_A = 25C
Derate above 25C
R_qJA
P_D
556
C/W
300
mW
2.4
mW/C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature
Range
R_qJA
T_J, T_stg
417
−55 to +150
C/W
C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
http://onsemi.com
SOT−23
CASE 318
STYLE 8
3
CATHODE
1
ANODE
MARKING DIAGRAM
5D M G
G
1
5D = Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
MMBD914LT1G
SMMBD914LT1G
MMBD914LT3G
SMMBD914LT3G
Package
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
Shipping^†
3,000 /
Tape & Reel
3,000 /
Tape & Reel
10,000 /
Tape & Reel
10,000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2011
1
November, 2011 − Rev. 7
Publication Order Number:
MMBD914LT1/D