SBC857BDW1T1G Datasheet, PDF (1/7 Pages) ON Semiconductor – Dual General Purpose Transistors

BC856BDW1T1G,
SBC856BDW1T1G Series,
BC857BDW1T1G,
SBC857BDW1T1G Series,
BC858CDW1T1G Series
Dual General Purpose
Transistors
PNP Duals
These transistors are designed for general purpose amplifier
applications. They are housed in the SOT−363/SC−88 which is
designed for low power surface mount applications.
Features
• S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
MAXIMUM RATINGS
Rating
Symbol Value
Unit
Collector −Emitter Voltage
BC856, SBC856
BC857, SBC857
BC858
V_CEO
V
−65
−45
−30
Collector −Base Voltage
BC856, SBC856
BC857, SBC857
BC858
V_CBO
V
−80
−50
−30
Emitter −Base Voltage
Collector Current −Continuous
Collector Current − Peak
V_EBO
I_C
I_C
−5.0
−100
−200
V
mAdc
mAdc
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation Per Device
P_D
FR−5 Board (Note 1)
380
mW
T_A = 25°C
Derate Above 25°C
250
mW/°C
3.0
mW/°C
Thermal Resistance,
Junction−to−Ambient
R_qJA
°C/W
328
Junction and Storage Temperature
Range
T_J, T_stg − 55 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 x 0.75 x 0.062 in
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
http://onsemi.com
SOT−363/SC−88
CASE 419B
STYLE 1
(3)
(2)
(1)
Q₁
Q₂
(4)
(5)
(6)
MARKING DIAGRAM
6
3x MG
G
1
3x = Specific Device Code
x = B, F, G, or L
(See Ordering Information)
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
© Semiconductor Components Industries, LLC, 2013
1
June, 2013 − Rev. 9
Publication Order Number:
BC856BDW1T1/D