RB520S30T1 Datasheet, PDF (1/3 Pages) ON Semiconductor – Schottky Barrier Diode

RB520S30T1
Schottky Barrier Diode
These Schottky barrier diodes are designed for high−speed
switching applications, circuit protection, and voltage clamping.
Extremely low forward voltage reduces conduction loss. Miniature
surface mount package is excellent for hand−held and portable
applications where space is limited.
Features
• Extremely Fast Switching Speed
• Extremely Low Forward Voltage 0.6 V (max) @ I_F = 200 mA
• Low Reverse Current
• ESD Rating: Class 3B per Human Body Model
Class C per Machine Model
• These are Pb−Free Devices
MAXIMUM RATINGS
Rating
Symbol Value
Unit
Reverse Voltage
V_R
30
Vdc
Forward Current DC
I_F
200
mA
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR−5 Board,
(Note 1) T_A = 25°C
Derate above 25°C
Symbol
P_D
Max
Unit
200
mW
1.57
mW/°C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature Range
1. FR−5 Minimum Pad.
R_qJA
T_J, T_stg
635
−55 to +150
°C/W
°C
ELECTRICAL CHARACTERISTICS (T_A = 25°C unless otherwise noted)
Characteristic
Symbol Min Typ Max Unit
Reverse Leakage
(V_R = 10 V)
I_R
− − 1.0 mA
Forward Voltage
(I_F = 200 mA)
V_F
− − 0.60 Vdc
http://onsemi.com
30 VOLT SCHOTTKY
BARRIER DIODE
1
CATHODE
2
ANODE
2
1
SOD−523
CASE 502
PLASTIC
MARKING DIAGRAM
5J M G
G
1
2
5J = Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation position may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping^†
RB520S30T1 SOD−523* 3000/Tape & Reel
RB520S30T1G SOD−523* 3000/Tape & Reel
*This package is inherently Pb−Free.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2005
1
December, 2005 − Rev. 7
Publication Order Number:
RB520S30T1/D