R261 Datasheet, PDF (1/28 Pages) ON Semiconductor – Advanced Noise Reduction Solution for Voice Capture Devices

BelaSigna R261
Advance Information
Advanced Noise Reduction
Solution for Voice Capture
Devices
Introduction
BelaSigna^® R261 is a complete system−on−chip (SoC) solution that
provides advanced dual−microphone noise reduction in voice capture
applications such as laptops, mobile phones, webcams, tablet
computers and other applications that will benefit from improved
voice clarity.
Featuring a novel approach to removing mechanical, stationary and
non−stationary noise, the chip preserves voice naturalness for greater
speech intelligibility even when the talker is further away or not
optimally aligned with microphones providing unmatched freedom of
movement for end−users. Designed to be compatible with a wide
range of codecs, baseband chips and microphones without the need for
calibration, BelaSigna R261 is easy to integrate, improving
manufacturers’ speed to market.
Additional features include the ability to customize multiple voice
capture modes and tune the algorithm to the unique needs of a
manufacturer’s device. The chip includes a highly optimized
DSP−based application controller with industry−leading energy
efficiency and is packaged in two highly compact 5.3 mm² WLCSPs
to fit into even the most sized−constrained architectures and allow the
use of the cheapest printed circuit board design technologies.
Key Features
• Advanced Two−Microphone Noise Reduction Algorithm
• Preserves Voice Naturalness
• Supports Close−Talk and Far−Talk
• Conference Mode enables 360 Degrees Voice Pick−up
• Configurable Algorithm Performance
• Ultra Low Power Consumption
• Ultra Miniature Form Factor
• Complete System−on−Chip (SoC)
• Highly Flexible Clocking Architecture
• Hardware Configuration Interfaces
• Prototyping Tools
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
• Laptop Computers
• Mobile Phones
• Tablet PCs
• Webcams
• Any Portable Audio Application with Voice Pick−up
This document contains information on a new product. Specifications and information
herein are subject to change without notice.
© Semiconductor Components Industries, LLC, 2010
1
November, 2010 − Rev. P2
http://onsemi.com
WLCSP−30
W SUFFIX
CASE 567CT
WLCSP−26
W SUFFIX
CASE 567CY
MARKING DIAGRAMS
1
BR261
W30
ALYW
1
BR261
W26
ALYW
BR261
W30
W26
A
L
YW
= BelaSigna R261
= 30−ball version
= 26−ball version
= Assembly Location
= Wafer Lot
= Date Code Year & Week
= Pb−Free Package
= A1 Corner Indicator
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 28 of this data sheet.
Publication Order Number:
BR261/D