NZQA6V8AXV5T2G Datasheet, PDF (1/5 Pages) ON Semiconductor – Transient Voltage Suppressors ESD Protection Diode with Low Clamping Voltage

NZQA5V6AXV5 Series
Transient Voltage Suppressors
ESD Protection Diode with Low Clamping
Voltage
This integrated transient voltage suppressor device (TVS) is
designed for applications requiring transient overvoltage protection. It
is intended for use in sensitive equipment such as computers, printers,
business machines, communication systems, medical equipment, and
other applications. Its integrated design provides very effective and
reliable protection for four separate lines using only one package.
These devices are ideal for situations where board space is at a premium.
Features
• Low Clamping Voltage
• Small SOT−553 SMT Package
• Stand Off Voltage: 3 V
• Low Leakage Current
• Four Separate Unidirectional Configurations for Protection
• ESD Protection: IEC61000−4−2: Level 4 ESD Protection
MILSTD 883C − Method 3015−6: Class 3
• Complies to USB 1.1 Low Speed & Full Speed Specifications
• These are Pb−Free Devices
Benefits
• Provides Protection for ESD Industry Standards: IEC 61000, HBM
• Protects Four Lines Against Transient Voltage Conditions
• Minimize Power Consumption of the System
• Minimize PCB Board Space
Typical Applications
• Instrumentation Equipment
• Serial and Parallel Ports
• Microprocessor Based Equipment
• Notebooks, Desktops, Servers
• Cellular and Portable Equipment
MAXIMUM RATINGS (T_A = 25°C unless otherwise noted)
Characteristic
Symbol Value
Unit
Peak Power Dissipation (Note 1)
Steady State Power − 1 Diode (Note 2)
Thermal Resistance,
Junction−to−Ambient
Above 25°C, Derate
Maximum Junction Temperature
Operating Junction and Storage
Temperature Range
P_PK
P_D
R_qJA
T_Jmax
T_J T_stg
20
380
327
3.05
150
−55 to
+150
W
mW
°C/W
mW/°C
°C
°C
Lead Solder Temperature (10 seconds
T_L
duration)
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Non−repetitive current per Figure 5.
2. Only 1 diode under power. For all 4 diodes under power, P_D will be 25%.
Mounted on FR−4 board with min pad.
See Application Note AND8308/D for further description of
survivability specs.
© Semiconductor Components Industries, LLC, 2009
1
September, 2009 − Rev. 7
http://onsemi.com
1
5
2
3
4
SOT−553
CASE 463B
PLASTIC
MARKING DIAGRAM
xx M G
G
xx
= Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping^†
NZQA5V6AXV5T1 SOT−553* 4000/Tape & Reel
NZQA5V6AXV5T1G SOT−553* 4000/Tape & Reel
NZQA6V8AXV5T1 SOT−553* 4000/Tape & Reel
NZQA6V8AXV5T1G SOT−553* 4000/Tape & Reel
NZQA6V8AXV5T3 SOT−553* 16000/Tape & Reel
NZQA6V8AXV5T3G SOT−553* 16000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
*This package is inherently Pb−Free.
Publication Order Number:
NZQA5V6AXV5/D