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NZQA5V6AXV5_09 Datasheet, PDF (1/5 Pages) ON Semiconductor – Transient Voltage Suppressors ESD Protection Diode with Low Clamping Voltage | |||
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NZQA5V6AXV5 Series
Transient Voltage Suppressors
ESD Protection Diode with Low Clamping
Voltage
This integrated transient voltage suppressor device (TVS) is
designed for applications requiring transient overvoltage protection. It
is intended for use in sensitive equipment such as computers, printers,
business machines, communication systems, medical equipment, and
other applications. Its integrated design provides very effective and
reliable protection for four separate lines using only one package.
These devices are ideal for situations where board space is at a premium.
Features
⢠Low Clamping Voltage
⢠Small SOTâ553 SMT Package
⢠Stand Off Voltage: 3 V
⢠Low Leakage Current
⢠Four Separate Unidirectional Configurations for Protection
⢠ESD Protection: IEC61000â4â2: Level 4 ESD Protection
MILSTD 883C â Method 3015â6: Class 3
⢠Complies to USB 1.1 Low Speed & Full Speed Specifications
⢠These are PbâFree Devices
Benefits
⢠Provides Protection for ESD Industry Standards: IEC 61000, HBM
⢠Protects Four Lines Against Transient Voltage Conditions
⢠Minimize Power Consumption of the System
⢠Minimize PCB Board Space
Typical Applications
⢠Instrumentation Equipment
⢠Serial and Parallel Ports
⢠Microprocessor Based Equipment
⢠Notebooks, Desktops, Servers
⢠Cellular and Portable Equipment
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Characteristic
Symbol Value
Unit
Peak Power Dissipation (Note 1)
Steady State Power â 1 Diode (Note 2)
Thermal Resistance,
JunctionâtoâAmbient
Above 25°C, Derate
Maximum Junction Temperature
Operating Junction and Storage
Temperature Range
PPK
PD
RqJA
TJmax
TJ Tstg
20
380
327
3.05
150
â55 to
+150
W
mW
°C/W
mW/°C
°C
°C
Lead Solder Temperature (10 seconds
TL
duration)
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Nonârepetitive current per Figure 5.
2. Only 1 diode under power. For all 4 diodes under power, PD will be 25%.
Mounted on FRâ4 board with min pad.
See Application Note AND8308/D for further description of
survivability specs.
© Semiconductor Components Industries, LLC, 2009
1
September, 2009 â Rev. 7
http://onsemi.com
1
5
2
3
4
SOTâ553
CASE 463B
PLASTIC
MARKING DIAGRAM
xx M G
G
xx
= Device Code
M
= Date Code*
G
= PbâFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shippingâ
NZQA5V6AXV5T1 SOTâ553* 4000/Tape & Reel
NZQA5V6AXV5T1G SOTâ553* 4000/Tape & Reel
NZQA6V8AXV5T1 SOTâ553* 4000/Tape & Reel
NZQA6V8AXV5T1G SOTâ553* 4000/Tape & Reel
NZQA6V8AXV5T3 SOTâ553* 16000/Tape & Reel
NZQA6V8AXV5T3G SOTâ553* 16000/Tape & Reel
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
*This package is inherently PbâFree.
Publication Order Number:
NZQA5V6AXV5/D
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