NVTR0202PLT1G Datasheet, PDF (1/5 Pages) ON Semiconductor – Power MOSFET −20 V, −400 mA, P−Channel SOT−23 Package

NTR0202PL, NVTR0202PL
Power MOSFET
−20 V, −400 mA, P−Channel
SOT−23 Package
Features
• Low R_DS(on) Provides Higher Efficiency and Extends Battery Life
R_DSon = 0.80 W, V_GS = −10 V
R_DSon = 1.10 W, V_GS = −4.5 V
• Miniature SOT−23 Surface Mount Package Saves Board Space
• AEC−Q101 Qualified and PPAP Capable − NVTR0202PL
• These Devices are Pb−Free and are RoHS Compliant
Applications
• DC−DC Converters
• Computers
• Printers
• PCMCIA Cards
• Cellular and Cordless Telephones
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Continuous Drain Current @ T_A = 25°C
Pulsed Drain Current (t_p ≤ 10 ms)
Total Power Dissipation @ T_A = 25°C (Note 1)
Operating and Storage Temperature Range
V_DSS
V_GS
I_D
I_DM
P_D
T_J, T_stg
−20
V
$20 V
−0.4
A
−1.0
225 mW
− 55 to °C
150
Thermal Resistance − Junction−to−Ambient
Source Current (Body Diode)
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 s
R_qJA
I_S
T_L
556 °C/W
0.4
A
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2%.
http://onsemi.com
V_(BR)DSS
−20 V
R_DS(on) Typ
550 mW @ −10 V
I_D MAX
−400 mA
P−Channel
D
G
S
MARKING DIAGRAM &
PIN ASSIGNMENT
Drain
3
SOT−23
CASE 318
STYLE 21
PL M G
G
1
Gate
2
Source
PL
= Specific Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device
NTR0202PLT1G
Package
SOT−23
(Pb−Free)
Shipping^†
3000 / Tape &
Reel
NTR0202PLT3G SOT−23 10000 / Tape &
(Pb−Free)
Reel
NVTR0202PLT1G SOT−23 3000 / Tape &
(Pb−Free)
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
1
October, 2011 − Rev. 5
Publication Order Number:
NTR0202PL/D