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NVMFD5875NL Datasheet, PDF (1/6 Pages) ON Semiconductor – Dual N−Channel Power MOSFET | |||
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NVMFD5875NL
Product Preview
Power MOSFET
60 V, 33 mW, 22 A, Dual NâChannel, Logic
Level, Dual SO8FL
Features
⢠Low RDS(on) to Minimize Conduction Losses
⢠Low Capacitance to Minimize Driver Losses
⢠NVMFD5875NLWF â Wettable Flanks Option for Enhanced Optical
Inspection
⢠AECâQ101 Qualified and PPAP Capable
⢠These Devices are PbâFree, Halogen Free and are RoHS Compliant
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
DrainâtoâSource Voltage
VDSS
60
V
GateâtoâSource Voltage
VGS
"20 V
Continuous Drain Cur-
TC = 25°C
ID
rent RqJC (Notes 1, 2,
3, 4)
Steady
TC = 100°C
Power Dissipation
State TC = 25°C
PD
RqJC (Notes 1, 2, 3)
TC = 100°C
22
A
15
32
W
16
Continuous Drain Cur-
TA = 25°C
ID
rent RqJA (Notes 1 &
3, 4)
Steady TA = 100°C
Power Dissipation
RqJA (Notes 1, 3)
State TA = 25°C
PD
TA = 100°C
7
A
5.8
3.2
W
2.2
Pulsed Drain Current TA = 25°C, tp = 10 ms
IDM
80
A
Operating Junction and Storage Temperature
TJ, Tstg â55 to °C
+175
Source Current (Body Diode)
Single Pulse Drainâ
toâSource Avalanche
Energy (TJ = 25°C,
VDD = 24 V, VGS =
10 V, RG = 25 W)
(IL(pk) = 14.5 A, L =
0.1 mH)
(IL(pk) = 6.3 A, L =
2 mH)
Lead Temperature for Soldering Purposes
(1/8â³ from case for 10 s)
IS
19
A
EAS
10.5 mJ
40
TL
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)
Parameter
Symbol Value Unit
JunctionâtoâCase â Steady State (Note 2, 3)
RqJC
4.65 °C/W
JunctionâtoâAmbient â Steady State (Note 3)
RqJA
47
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Psi (Y) is used as required per JESD51â12 for packages in which
substantially less than 100% of the heat flows to single case surface.
3. Surfaceâmounted on FR4 board using a 650 mm2, 2 oz. Cu pad.
4. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
www.onsemi.com
V(BR)DSS
60 V
RDS(on) MAX
33 mW @ 10 V
45 mW @ 4.5 V
ID MAX
22 A
Dual NâChannel
D1
D2
G1
G2
S1
S2
1
DFN8 5x6
(SO8FL)
CASE 506BT
MARKING DIAGRAM
D1 D1
S1
D1
G1 5875xx D1
S2 AYWZZ D2
G2
D2
D2 D2
5875NL = Specific Device Code
for NVMFD5875NL
5875LW = Specific Device Code
for NVMFD5875NLWF
A
= Assembly Location
Y
= Year
W
= Work Week
ZZ
= Lot Traceability
ORDERING INFORMATION
Device
Package Shippingâ
NVMFD5875NLT1G
DFN8 1500 / Tape &
(PbâFree)
Reel
NVMFD5875NLWFT1G DFN8 1500 / Tape &
(PbâFree)
Reel
NVMFD5875NLT3G
DFN8 5000 / Tape &
(PbâFree)
Reel
NVMFD5875NLWFT3G DFN8 5000 / Tape &
(PbâFree)
Reel
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2015
1
November, 2015 â Rev. P1
Publication Order Number:
NVMFD5875NL/D
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