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NVJS4151P Datasheet, PDF (1/5 Pages) ON Semiconductor – Single P−Channel Trench Power MOSFET
NVJS4151P
Trench Power MOSFET
−20 V, −4.1 A, Single P−Channel, SC−88
Features
• Leading Trench Technology for Low RDS(ON) Extending Battery Life
• SC−88 Small Outline (2x2 mm) for Maximum Circuit Board
Utilization, Same as SC−70−6
• Gate Diodes for ESD Protection
• AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
• High Side Load Switch
• Cell Phones, Computing, Digital Cameras, MP3s and PDAs
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
VDSS
−20
V
Gate−to−Source Voltage
VGS
±12
V
Continuous Drain
Current (Note 1)
Steady TA = 25 °C
ID
State
TA = 85 °C
−3.2
A
−2.3
t ≤ 5 s TA = 25 °C
−4.1
Power Dissipation
(Note 1)
Steady TA = 25 °C PD
State
1.2
W
Pulsed Drain Current
tp = 10 ms
IDM
−13
A
Operating Junction and Storage Temperature
TJ,
−55 to °C
TSTG
150
Source Current (Body Diode)
IS
−0.8
A
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
TL
260
°C
ESD
Human Body Model (HBM) ESD 4000 V
THERMAL RESISTANCE RATINGS (Note 1)
Parameter
Symbol Max Unit
Junction−to−Ambient – Steady State
RqJA
125 °C/W
Junction−to−Ambient − t ≤ 5 s
RqJA
75
Junction−to−Lead – Steady State
RqJL
45
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Surface mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
http://onsemi.com
V(BR)DSS
−20 V
RDS(on) Typ
55 mW @ −4.5 V
70 mW @ −2.5 V
180 mW @ −1.8 V
ID Max
−4.1 A
SC−88 (SOT−363)
D
1
6
D
D
2
5
D
G
3
4
S
Top View
1
SC−88/SOT−363
CASE 419B
MARKING DIAGRAM &
PIN ASSIGNMENT
DDS
6
VTY M G
G
1
DDG
VTY = Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
NVJS4151PT1G SC−88 3000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2014
1
August, 2014 − Rev. 1
Publication Order Number:
NVJS4151P/D