NVJD5121N Datasheet, PDF (1/5 Pages) ON Semiconductor – Power MOSFET Dual N−Channel

NVJD5121N
Power MOSFET
60 V, 300 mA, Dual N−Channel with ESD
Protection, SC−88
Features
• Low R_DS(on)
• Low Gate Threshold
• Low Input Capacitance
• ESD Protected Gate
• NVJD Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• This is a Pb−Free Device
Applications
• Low Side Load Switch
• DC−DC Converters (Buck and Boost Circuits)
MAXIMUM RATINGS (T_J = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
Steady T_A = 25°C
State
T_A = 85°C
t ≤ 5 s T_A = 25°C
T_A = 85°C
Steady T_A = 25°C
State
V_DSS
V_GS
I_D
P_D
60
V
±20
V
300 mA
233
310
240
300 mW
t≤5s
319
Pulsed Drain Current
t_p = 10 ms
I_DM
1200 mA
Operating Junction and Storage Temperature T_J, T_STG −55 to _°C
175
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
I_S
250 mA
T_L
260
°C
Gate−Source ESD Rating (HBM)
Gate−Source ESD Rating (MM)
ESD_HBM 2000
V
ESD_MM
200
V
THERMAL RESISTANCE RATINGS
Parameter
Symbol Value Unit
Junction−to−Ambient – Steady State
R_qJA
500 °C/W
Junction−to−Ambient – t ≤ 5 s
R_qJA
470
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Surface mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [2 oz] including traces).
http://onsemi.com
V_(BR)DSS
60 V
R_DS(on) MAX
1.6 W @ 10 V
2.5 W @ 4.5 V
I_D Max
300 mA
SC−88 (SOT−363)
S₁
1
6
D₁
G₁
2
5
G₂
D₂
3
4
S₂
Top View
MARKING DIAGRAM &
PIN ASSIGNMENT
D1 G2 S2
6
1
SC−88/SOT−363
CASE 419B
STYLE 26
VTF M G
G
1
S1 G1 D2
VTF = Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping^†
NVJD5121NT1G SC−88 3000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2014
1
June, 2014 − Rev. 0
Publication Order Number:
NVJD5121N/D