NVGS3443T1G Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET 4.4 Amps, 20 Volts

NTGS3443, NVGS3443
Power MOSFET
4.4 Amps, 20 Volts
P−Channel TSOP−6
Features
• Ultra Low R_DS(on)
• Higher Efficiency Extending Battery Life
• Miniature TSOP−6 Surface Mount Package
• These Devices are Pb−Free and are RoHS Compliant
• NVGS Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
Applications
• Power Management in Portable and Battery−Powered Products,
i.e.: Cellular and Cordless Telephones, and PCMCIA Cards
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Rating
Symbol Value
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Thermal Resistance
Junction−to−Ambient (Note 1)
Total Power Dissipation @ T_A = 25°C
Drain Current − Continuous @ T_A = 25°C
− Pulsed Drain Current (T_p t 10 mS)
Thermal Resistance
Junction−to−Ambient (Note 2)
Total Power Dissipation @ T_A = 25°C
Drain Current − Continuous @ T_A = 25°C
− Pulsed Drain Current (T_p t 10 mS)
Thermal Resistance
Junction−to−Ambient (Note 3)
Total Power Dissipation @ T_A = 25°C
Drain Current − Continuous @ T_A = 25°C
− Pulsed Drain Current (T_p t 10 mS)
Operating and Storage Temperature Range
V_DSS
V_GS
R_qJA
P_d
I_D
I_DM
R_qJA
P_d
I_D
I_DM
R_qJA
P_d
I_D
I_DM
T_J, T_stg
−20
"12
244
0.5
−2.2
−10
128
1.0
−3.1
−14
62.5
2.0
−4.4
−20
−55 to
150
Maximum Lead Temperature for Soldering
Purposes for 10 Seconds
T_L
260
Unit
Volts
Volts
°C/W
Watts
Amps
Amps
°C/W
Watts
Amps
Amps
°C/W
Watts
Amps
Amps
°C
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Minimum FR−4 or G−10 PCB, operating to steady state.
2. Mounted onto a 2 in square FR−4 board (1 in sq, 2 oz. Cu. 0.06″ thick single
sided), operating to steady state.
3. Mounted onto a 2 in square FR−4 board (1 in sq, 2 oz. Cu. 0.06″ thick single
sided), t t 5.0 seconds.
http://onsemi.com
4.4 AMPERES
20 VOLTS
R_DS(on) = 65 mW
P−Channel
1256
3
4
MARKING DIAGRAM &
PIN ASSIGNMENT
Drain Drain Source
654
1
TSOP−6
CASE 318G
STYLE 1
443 M G
G
123
Drain Drain Gate
443 = Specific Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping^†
NTGS3443T1G TSOP−6 3000 / Tape & Reel
(Pb−Free)
NVGS3443T1G TSOP−6 3000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2012
1
December, 2012 − Rev. 5
Publication Order Number:
NTGS3443T1/D