NVF3055L108T1G Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET 3.0 A, 60 V, Logic Level, N−Channel SOT−223

NTF3055L108,
NVF3055L108
Power MOSFET
3.0 A, 60 V, Logic Level, N−Channel
SOT−223
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
Features
• AEC Q101 Qualified − NVF3055L108
• These Devices are Pb−Free and are RoHS Compliant
Applications
• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits
MAXIMUM RATINGS (T_C = 25°C unless otherwise noted)
Rating
Symbol Value
Drain−to−Source Voltage
V_DSS
60
Drain−to−Gate Voltage (R_GS = 1.0 MW)
V_DGR
60
Gate−to−Source Voltage
− Continuous
− Non−repetitive (t_p ≤ 10 ms)
V_GS
± 15
± 20
Drain Current
− Continuous @ T_A = 25°C
− Continuous @ T_A = 100°C
− Single Pulse (t_p ≤ 10 ms)
I_D
3.0
I_D
1.4
I_DM
9.0
Total Power Dissipation @ T_A = 25°C (Note 1)
Total Power Dissipation @ T_A = 25°C (Note 2)
Derate above 25°C
P_D
2.1
1.3
0.014
Unit
Vdc
Vdc
Vdc
Vpk
Adc
Apk
Watts
Watts
W/°C
Operating and Storage Temperature Range
T_J, T_stg − 55
°C
to 175
Single Pulse Drain−to−Source Avalanche
E_AS
74
mJ
Energy − Starting T_J = 25°C
(V_DD = 25 Vdc, V_GS = 5.0 Vdc,
I_L(pk) = 7.0 Apk, L = 3.0 mH, V_DS = 60 Vdc)
Thermal Resistance
−Junction−to−Ambient (Note 1)
−Junction−to−Ambient (Note 2)
R_qJA
R_qJA
°C/W
72.3
114
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
T_L
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR4 board using 1″ pad size, 1 oz.
(Cu. Area 0.0995 in²).
2. When surface mounted to an FR4 board using minimum recommended pad
size, 2−2.4 oz. (Cu. Area 0.272 in²).
http://onsemi.com
3.0 A, 60 V
R_DS(on) = 120 mW
N−Channel
D
G
S
4
SOT−223
1
2
3
CASE 318E
STYLE 3
MARKING DIAGRAM
3055L = Device Code
A
= Assembly Location
Y
= Year
AYW
3055LG
G
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
PIN ASSIGNMENT
4 Drain
123
Gate Drain Source
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2011
1
October, 2011 − Rev. 6
Publication Order Number:
NTF3055L108/D