NVD5807NT4G Datasheet, PDF (1/7 Pages) ON Semiconductor – Power MOSFET 40 V, 23 A, Single N−Channel, DPAK/IPAK

NTD5807N, NVD5807N
Power MOSFET
40 V, 23 A, Single N−Channel, DPAK/IPAK
Features
• Low R_DS(on)
• High Current Capability
• Avalanche Energy Specified
• AEC−Q101 Qualified and PPAP Capable − NVD5807N
• These Devices are Pb−Free and are RoHS Compliant
Applications
• CCFL Backlight
• DC Motor Control
• Class D Amplifier
• Power Supply Secondary Side Synchronous Rectification
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
40
V
Gate−to−Source Voltage − Continuous
V_GS
"20
V
Gate−to−Source Voltage
− Non−Repetitive (t_p < 10 mS)
V_GS
"30
V
Continuous Drain
Current (R_qJC)
(Note 1)
Power Dissipation
(R_qJC) (Note 1)
T_C = 25°C
I_D
Steady T_C = 100°C
State
T_C = 25°C
P_D
23
A
16
33
W
Pulsed Drain Current
t_p = 10 ms
I_DM
45
A
Operating Junction and Storage Temperature T_J, T_stg −55 to °C
175
Source Current (Body Diode)
I_S
23
A
Single Pulse Drain−to−Source Avalanche
E_AS
29.4 mJ
Energy (V_DD = 50 V, V_GS = 10 V, R_G = 25 W,
I_L(pk) = 14 A, L = 0.3 mH, V_DS = 40 V)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T_L
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol Value Unit
Junction−to−Case (Drain)
R_qJC
4.5 °C/W
Junction−to−Ambient − Steady State (Note 1) R_qJA
107
1. Surface−mounted on FR4 board using the minimum recommended pad size.
http://onsemi.com
V_(BR)DSS
40 V
R_DS(on) MAX
37 mW @ 4.5 V
31 mW @ 10 V
D
I_D MAX
16 A
23 A
G
S
N−CHANNEL MOSFET
4
4
12
3
DPAK
CASE 369AA
(Surface Mount)
STYLE 2
1
2
IPAK
3 CASE 369D
(Straight Lead
DPAK)
MARKING DIAGRAMS
& PIN ASSIGNMENT
4
Drain
4
Drain
2
1 ^Drain 3
Gate Source
1 23
Gate Drain Source
A
= Assembly Location*
Y
= Year
WW = Work Week
5807N = Device Code
G
= Pb−Free Package
* The Assembly Location code (A) is front side
optional. In cases where the Assembly Location is
stamped in the package, the front side assembly
code may be blank.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
1
June, 2014 − Rev. 5
Publication Order Number:
NTD5807N/D