|
NVD5414NT4G Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET 24 Amps, 60 Volts Single N−Channel | |||
|
NTD5414N, NVD5414N
Power MOSFET
24 Amps, 60 Volts Single NâChannel
DPAK
Features
⢠Low RDS(on)
⢠High Current Capability
⢠Avalanche Energy Specified
⢠AEC Q101 Qualified â NVD5414N
⢠These Devices are PbâFree and are RoHS Compliant
Applications
⢠LED Lighting and LED Backlight Drivers
⢠DCâDC Converters
⢠DC Motor Drivers
⢠Power Supplies Secondary Side Synchronous Rectification
MAXIMUM RATINGS (TJ = 25°C Unless otherwise specified)
Parameter
Symbol Value Unit
DrainâtoâSource Voltage
VDSS
60
V
GateâtoâSource Voltage â Continuous
VGS
$20
V
GateâtoâSource Voltage â Nonrepetitive
(TP < 10 ms)
VGS
$30
V
Continuous Drain
Steady TC = 25°C
ID
Current RqJC
(Note 1)
State
TC = 100°C
24
A
16
Power Dissipation
Steady TC = 25°C
PD
RqJC (Note 1)
State
55
W
Pulsed Drain Current
tp = 10 ms
IDM
75
A
Operating and Storage Temperature Range
TJ, Tstg â55 to °C
+175
Source Current (Body Diode)
Single Pulse DrainâtoâSource Avalanche
Energy â Starting TJ = 25°C
(VDD = 50 Vdc, VGS = 10 V, IL(pk) = 24 A,
L = 0.3 mH, RG = 25 W)
Lead Temperature for Soldering
Purposes, 1/8â³ from Case for 10 Seconds
IS
24
A
EAS
86.4 mJ
TL
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol Max Unit
JunctionâtoâCase (Drain) Steady State
(Note 1)
RqJC
RqJA
2.7 °C/W
58.6
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 sq in pad size,
(Cu Area 1.127 sq in [1 oz] including traces).
http://onsemi.com
V(BR)DSS
60 V
RDS(ON) MAX
37 mW @ 10 V
ID MAX
(Note 1)
24 A
NâChannel
D
G
S
12
3
MARKING
DIAGRAMS
4
Drain
4
DPAK
CASE 369AA
STYLE 2
1
Gate
2
Drain
3
Source
5414N
Y
WW
G
= Device Code
= Year
= Work Week
= PbâFree Device
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2011
1
October, 2011 â Rev. 1
Publication Order Number:
NTD5414N/D
|
▷ |