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NVB60N06T4G Datasheet, PDF (1/9 Pages) ON Semiconductor – Power MOSFET 60 V, 60 A, N−Channel D2PAK
NTB60N06, NVB60N06
Power MOSFET
60 V, 60 A, N−Channel D2PAK
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
Features
• AEC−Q101 Qualified and PPAP Capable − NVB60N06
• These Devices are Pb−Free and are RoHS Compliant
Typical Applications
• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Drain−to−Gate Voltage (RGS = 10 MW)
Gate−to−Source Voltage
− Continuous
− Non−Repetitive (tpv10 ms)
Drain Current
− Continuous @ TA = 25°C
− Continuous @ TA = 100°C
− Single Pulse (tpv10 ms)
Total Power Dissipation @ TA = 25°C
Derate above 25°C
Total Power Dissipation @ TA = 25°C (Note 1)
Operating and Storage Temperature Range
VDSS
60 Vdc
VDGR
60
Vdc
Vdc
VGS
"20
VGS
"30
ID
ID
IDM
PD
TJ, Tstg
60
42.3
180
150
1.0
2.4
−55 to
+175
Adc
Apk
W
W/°C
W
°C
Single Pulse Drain−to−Source Avalanche
Energy − Starting TJ = 25°C
(VDD = 75 Vdc, VGS = 10 Vdc, L = 0.3 mH
IL(pk) = 55 A, VDS = 60 Vdc)
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient (Note 1)
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
EAS
454 mJ
RqJC
RqJA
TL
°C/W
1.0
62.5
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR4 board using minimum recommended pad
size, (Cu Area 0.412 in2).
http://onsemi.com
60 VOLTS, 60 AMPERES
RDS(on) = 14 mW
N−Channel
D
G
S
MARKING
DIAGRAM
4
Drain
4
D2PAK
NTx60N06
2
CASE 418B
STYLE 2
AYWW
3
2
1 Drain 3
Gate
Source
NTx60N06
x
A
Y
WW
= Device Code
= P or B
= Assembly Location
= Year
= Work Week
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
© Semiconductor Components Industries, LLC, 2011
1
October, 2011 − Rev. 0
Publication Order Number:
NTP60N06/D