NVB25P06T4G Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET

NTB25P06, NVB25P06
Power MOSFET
−60 V, −27.5 A, P−Channel D²PAK
Designed for low voltage, high speed switching applications and to
withstand high energy in the avalanche and commutation modes.
Features
• AEC Q101 Qualified − NVB25P06
• These Devices are Pb−Free and are RoHS Compliant
Typical Applications
• PWM Motor Controls
• Power Supplies
• Converters
• Bridge Circuits
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
− Continuous
− Non−Repetitive (t_pv10 ms)
Drain Current
− Continuous @ T_A = 25°C
− Single Pulse (t_pv10 ms)
Total Power Dissipation @ T_A = 25°C
Operating and Storage
Temperature Range
V_DSS
−60
V
V_GS
"15
V
V_GSM "20 Vpk
I_D
27.5
A
I_DM
80
Apk
P_D
120
W
T_J, T_stg − 55 to °C
+175
Single Pulse Drain−to−Source Avalanche
Energy − Starting T_J = 25°C
(V_DD = 25 V, V_GS = 10 V,
I_L(pk) = 20 A, L = 3 mH, R_G = 25 W)
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
Maximum Lead Temperature for Soldering
Purposes, (1/8″ from case for 10 s)
E_AS
600 mJ
R_qJC
R_qJA
R_qJA
T_L
°C/W
1.25
46.8
63.2
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR4 board using 1″ pad size
(Cu Area 1.127 in²).
2. When surface mounted to an FR4 board using the minimum recommended
pad size (Cu Area 0.412 in²).
http://onsemi.com
V_(BR)DSS
−60 V
R_DS(on) TYP
65 mW @ −10 V
I_D MAX
−27.5 A
P−Channel
D
G
S
MARKING DIAGRAM
& PIN ASSIGNMENT
Drain
4
2
1
3
D²PAK
CASE 418B
NTB
25P06G
AYWW
Drain
Gate
Source
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
ORDERING INFORMATION
Device
NTB25P06T4G
Package
D²PAK
(Pb−Free)
Shipping^†
800 / Tape & Reel
NVB25P06T4G
D²PAK 800 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
1
October, 2011 − Rev. 4
Publication Order Number:
NTB25P06/D