NUP8011MU_17 Datasheet, PDF (1/5 Pages) ON Semiconductor – Transient Voltage Suppressors

NUP8011MU
Transient Voltage Suppressors
ESD Protection Diodes with Low
Clamping Voltage Array
This integrated transient voltage suppressor device (TVS) is
designed for applications requiring transient overvoltage protection. It
is intended for use in sensitive equipment such as computers, printers,
business machines, communication systems, and other applications.
Its integrated design provides very effective and reliable protection for
eight separate lines using only one package. These devices are ideal
for situations where board space is at a premium.
Features
• Low Clamping Voltage
• UDFN Package, 1.2 x 1.8 mm
• Standoff Voltage: 4.3 V
• Low Leakage Current
• IEC61000−4−2, Level 4 ESD Protection
• Moisture Sensitivity Level 1
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Benefits
• Provides Protection for ESD Industry Standards: IEC 61000, HBM
• Protects the Line Against Transient Voltage Conditions
• Minimize Power Consumption of the System
• Minimize PCB Board Space
Applications
• ESD Protection for Data Lines
• Wireless Phones
• Handheld Products
• Notebook Computers
• LCD Displays
MAXIMUM RATINGS (T_A = 25°C unless otherwise noted)
Characteristic
Symbol
Value
Unit
Steady State Power − 1 Diode (Note 1)
Thermal Resistance,
Junction−to−Ambient
Above 25°C, Derate
P_D
R_qJA
380
mW
327
°C/W
3.05
mW/°C
Maximum Junction Temperature
T_Jmax
150
°C
Operating Temperature Range
T_OP
−40 to +85
°C
Storage Temperature Range
T_stg −55 to +150 °C
Lead Solder Temperature (10 seconds
T_L
duration)
260
°C
IEC 61000−4−2 (ESD)Contact
$8.0
kV
Machine Model − Class C
MM
400
V
Human Body Model − Class 3B
HBM
8.0
kV
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Only 1 diode under power. For all 4 diodes under power, P_D will be 25%.
Mounted on FR−4 board with min pad.
See Application Note AND8308/D for further description of
survivability specs.
www.onsemi.com
1
8
2
7
3
6
4
5
(Top View)
8
1
UDFN8
CASE 517AD
MARKING
DIAGRAM
P3 M
1
G
P3 = Specific Device Code
M = Month Code
G = Pb−Free Package
PIN CONNECTIONS
1
4
8
5
ORDERING INFORMATION
Device
Package
Shipping
NUP8011MUTAG UDFN8 3000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2017
1
February, 2017 − Rev. 3
Publication Order Number:
NUP8011MU/D