NUP4301MR6T1_05 Datasheet, PDF (1/4 Pages) ON Semiconductor – Low Capacitance Diode Array for ESD Protection in Four Data Lines

NUP4301MR6T1
Low Capacitance Diode
Array for ESD Protection in
Four Data Lines
NUP4301MR6T1 is a MicroIntegrationt device designed to
provide protection for sensitive components from possible harmful
electrical transients; for example, ESD (electrostatic discharge).
Features
• Low Capacitance (1.5 pf Maximum Between I/O Lines)
• Single Package Integration Design
• Provides ESD Protection for JEDEC Standards JESD22
Machine Model = Class C
Human Body Model = Class 3B
• Protection for IEC61000−4−2 (Level 4)
8.0 kV (Contact)
15 kV (Air)
• Ensures Data Line Speed and Integrity
• Fewer Components and Less Board Space
• Direct the Transient to Either Positive Side or to the Ground
• Pb−Free Package is Available
Applications
• USB 1.1 and 2.0 Data Line Protection
• T1/E1 Secondary IC Protection
• T3/E3 Secondary IC Protection
• HDSL, IDSL Secondary IC Protection
• Video Line Protection
• Microcontroller Input Protection
• Base Stations
• I²C Bus Protection
MAXIMUM RATINGS (Each Diode) (T_J = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Reverse Voltage
Forward Current
Peak Forward Surge Current
Repetitive Peak Reverse Voltage
Average Rectified Forward
Current (Note 1)
(averaged over any 20 ms period)
V_R
70
Vdc
I_F
200 mAdc
I_FM(surge)
500
mAdc
V_RRM
70
V
I_F(AV)
715
mA
Repetitive Peak Forward Current
I_FRM
450
mA
Non−Repetitive Peak Forward Current
t = 1.0 ms
t = 1.0 ms
t = 1.0 S
I_FSM
A
2.0
1.0
0.5
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. FR−5 = 1.0  0.75  0.062 in.
© Semiconductor Components Industries, LLC, 2005
1
September, 2005 − Rev. 3
http://onsemi.com
54
6
123
TSOP−6
CASE 318F
PLASTIC
MARKING DIAGRAM
64M G
G
1
64
= Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location.
*Date Code orientation may vary depending
upon manufacturing location.
PIN CONFIGURATION
AND SCHEMATIC
I/O 1
V_N 2
1/O 3
6 I/O
5 V_P
4 I/O
ORDERING INFORMATION
Device
Package
Shipping^†
NUP4301MR6T1 TSOP−6 3000/Tape & Reel
NUP4301MR6T1G TSOP−6 3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
NUP4301MR6T1/D