English
Language : 

NUP4212UPMU Datasheet, PDF (1/4 Pages) ON Semiconductor – Quad Transient Voltage Suppressor Array
NUP4212UPMU
Quad Transient Voltage
Suppressor Array
ESD Protection Diodes with Ultra−Low
(0.7 pF) Capacitance
The four−line voltage transient suppressor array is designed to protect
voltage−sensitive components that require ultra−low capacitance from
ESD and transient voltage events. This device features a common anode
design which can protect up to four independent high speed data lines
and 1 or 2 separate 15 V TVS lines in a single six−lead UDFN low
profile package.
Excellent clamping capability, low capacitance, low leakage, and fast
response time make these parts ideal for ESD protection on designs
where board space is at a premium. Because of its low capacitance, it is
suited for use in high frequency designs such as a USB 2.0 high speed.
This device can be configured as a dual port USB device.
Features
• Low Capacitance Data Lines (0.7 pF Typical)
• Protects up to Four Data Lines Plus a VCC Pin
• UDFN Package, 1.6 x 1.6 mm
• Low Profile of 0.50 mm for Ultra Slim Design
• V1, V2 Pin = 15 V Protection
• D1, D2, D3, and D4 Pins = 5.2 V Minimum Protection
• ESD Rating: IEC61000−4−2: Level 4
− Contact (14 kV)
• This is a Pb−Free Device
Typical Applications
• USB 2.0 High−Speed Interface
• Cell Phones
• MP3 Players
• SIM Card Protection
MAXIMUM RATINGS (TJ = 25°C, unless otherwise specified)
Symbol
Rating
Value Unit
TJ
TSTG
TL
Operating Junction Temperature Range
Storage Temperature Range
Lead Solder Temperature – Maximum
(10 seconds)
−40 to 125 °C
−55 to 150 °C
260
°C
ESD
IEC 61000−4−2 Contact
14000
V
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
http://onsemi.com
D1 D2 D3 D4 V1 V2
MARKING
DIAGRAM
6
UDFN6 1.6 X 1.6 1
MU SUFFIX
P2 MG
1
CASE 517AP
G
P2 = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
D1 1
D2 2
D3 3
GND
6 V2
5 V1
4 D4
ORDERING INFORMATION
Device
Package
Shipping†
NUP4212UPMUTAG UDFN6 3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
See Application Note AND8308/D for further description of survivability specs.
© Semiconductor Components Industries, LLC, 2009
1
August, 2009− Rev. 1
Publication Order Number:
NUP4212UPMU/D