NUP4103FC Datasheet, PDF (1/5 Pages) ON Semiconductor – Four Channel ESD Array

NUP4103FC
Four Channel ESD Array
This integrated transient voltage suppressor device (TVS) is
designed for applications requiring transient overvoltage protection. It
is intended for use in sensitive portable equipment and other
applications. Its integrated design provides very effective and reliable
protection for four (4) separate lines using only one package. These
devices are ideal for situations where board space is a premium.
Features
• Unidirectional, Quad ESD Protection
• Ultra−small Flip−Chip Packaging (0.95 mm x 1.33 mm)
• Compliance with IEC61000−4−2 (Level 4) Requirements
• Maximum Leakage Current of 100 nA at 3.3 V
• Pb−Free Package is Available*
Benefits
• Protects Four Data Lines from ESD while Reducing Component
Count
• Small Package Saves on PCB Real Estate
• Provides Protection for ESD Industry Standards, IEC 61000,
HBM and MM
• Low Leakage Capability Minimizes Power Loss in the System
Applications
• ESD Protection for Portable Equipment
• Cell Phones
• MP3 Players
• PDAs
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
ESD Discharge IEC61000−4−2,
− Air Discharge
− Contact Discharge
Human Body Model
Machine Model
V_PP
kV
30
30
16
1.6
Junction Temperature
Operating Ambient Temperature Range
Storage Temperature Range
T_J
T_A
T_STG
150
°C
−40 to +85 °C
−55 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
http://onsemi.com
CIRCUIT DESCRIPTION
A1
C1
B2
A3
C3
1
5−PIN FLIP−CHIP CSP
PLASTIC
CASE 766AB
MARKING
DIAGRAM
ÈÈ E M G
G
E
= Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
TOP VIEW
(Bumps Down)
1 23
A
BOTTOM VIEW
(Bumps Up)
3 21
A
B
B
C
C
ORDERING INFORMATION
Device
Package
Shipping^†
NUP4103FCT1 Flip−Chip 3000/Tape & Reel
NUP4103FCT1G Flip−Chip 3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
1
March, 2006 − Rev. 1
Publication Order Number:
NUP4103FC/D