NUP4102XV6 Datasheet, PDF (1/3 Pages) ON Semiconductor – 6−Pin Bi−Directional Quad TVS Array

NUP4102XV6
6−Pin Bi−Directional Quad
TVS Array
This 6−Pin bi−directional transient suppressor array is designed for
applications requiring transient overvoltage protection capability. It is
intended for use in transient voltage and ESD sensitive equipment
such as computers, printers, cell phones, medical equipment, and other
applications. Its integrated design provides bi−directional protection
for four separate lines using a single SOT−563 package. This device is
ideal for situations where board space is a premium.
Features
• Bi−directional Protection for Four Lines in a
Single SOT−563 Package
• Peak Power Dissipation − 75 W (8x20 msec Waveform)
• Low Leakage Current (100 nA @ 12 V)
• Low Capacitance (< 15 pF)
• Provides ESD Protection for JEDEC Standards JESD22
− Machine Model = Class C
− Human Body Model = Class 3B
• Provides ESD Protection for IEC 61000−4−2, 15 kV (Air),
8 kV (Contact)
Mechanical Characteristics
• Void Free, Transfer−Molded, Thermosetting Plastic Case
• Corrosion Resistant Finish, Easily Solderable
• Package Designed for Optimal Automated Board Assembly
• Small Package Size for High Density Applications
Applications
• GSM Handsets and Accessories
• Other Telephone Sets
• Computers / Printers / Set−Top Boxes
MAXIMUM RATINGS (T_J=25°C, unless otherwise specified)
Rating
Symbol Value Unit
Peak Power Dissipation
8x20 msec Double Exponential Waveform,
(Note 1)
P_PK
75
W
Operating Junction Temperature Range
T_J
−40 to °C
125
Storage Temperature Range
T_STG −55 to °C
150
Lead Solder Temperature – Maximum (10 sec)
Human Body Model ( HBM)
Machine Model (MM)
IEC 61000−4−2 Air (ESD)
IEC 61000−4−2 Contact (ESD)
T_L
ESD
260 °C
16
kV
0.4
30
30
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Non−repetitive current pulse per Figure 3.
http://onsemi.com
6
4
2, 5
3
1
SOT−563
CASE 463A
PLASTIC
MARKING DIAGRAM
654
RP MG
G
123
RP = Device Marking
M = One Digit Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping^†
NUP4102XV6T1G SOT−563 4000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
1
January, 2006 − Rev. 1
Publication Order Number:
NUP4102XV6/D