NUP3115UPMU Datasheet, PDF (1/4 Pages) ON Semiconductor – Transient Voltage Suppressors

NUP3115UPMU
Transient Voltage
Suppressors
Low Capacitance ESD Protection for
High Speed Data
The three−line voltage transient suppressor array is designed to protect
voltage−sensitive components that require ultra−low capacitance from
ESD and transient voltage events. This device features a common anode
design which protects three independent high speed data lines and a V_CC
power line in a single six−lead UDFN low profile package.
Excellent clamping capability, low capacitance, low leakage, and fast
response time make these parts ideal for ESD protection on designs
where board space is at a premium. Because of its low capacitance, it is
suited for use in high frequency designs such as a USB 2.0 high speed.
Features
• Low Capacitance 0.8 pF
• UDFN Package, 1.6 x 1.6 mm
• Low Profile of 0.50 mm for Ultra Slim Design
• Stand Off Voltage: 5.5 V
• Low Leakage
• Protects up to Three Data Lines Plus a V_CC Pin
• V_CC Pin = 15 V Protection
• D₁, D₂, and D₃ Pins = 6.4 V Minimum Protection
• IEC61000−4−2: Level 4 ESD Protection
• This is a Pb−Free Device
Typical Applications
• USB 2.0 High−Speed Interface
• Cell Phones
• MP3 Players
• SIM Card Protection
MAXIMUM RATINGS (T_J = 25°C, unless otherwise specified)
Symbol
Rating
Value Unit
I_PK
Peak Pulse Current
V_CC Diode
5.0
A
8x20 msec double exponential waveform
T_J
T_STG
T_L
Operating Junction Temperature Range
Storage Temperature Range
Lead Solder Temperature – Maximum
(10 seconds)
−40 to 125 °C
−55 to 150 °C
260
°C
ESD
IEC 61000−4−2 Contact
8000
V
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
See Application Note AND8308/D for further description of
survivability specs.
http://onsemi.com
D₁ D₂ D₃
V_CC
6.8V 16V
MARKING
DIAGRAM
6
UDFN6 1.6x1.6
MU SUFFIX
1
P3 MG
1
CASE 517AP
G
P3 = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
D₁ 1
D₂ 2
D₃ 3
GND
6 V_CC
5 NC
4 NC
ORDERING INFORMATION
Device
Package
Shipping^†
NUP3115UPMUTAG UDFN6 3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2009
1
September, 2009− Rev. 1
Publication Order Number:
NUP3115UPMU/D