NUF6001MU Datasheet, PDF (1/4 Pages) ON Semiconductor – 6 Line EMI Filter with ESD Protection in UDFN Package

NUF6001MU
6 Line EMI Filter with ESD
Protection in UDFN
Package
This device is a 6 line EMI filter array for wireless applications.
Greater than −30 dB attenuation is obtained at frequencies from 800 MHz
to 3.0 GHz. The NUF6001MU has a cut−off frequency of 120 MHz and
can be used in applications for data rate up to 50 Mbps. This UDFN
package is specifically designed to enhance EMI filtering for low−profile
or slim design electronics especially where space and height is a
premium. It also offers ESD protection clamping transients from static
discharges. ESD protection is provided across all capacitors.
Features
• EMI Filtering and ESD Protection
• Integration of 30 Discrete Components
• UDFN Package, 1.2 x 2.5 mm
• Moisture Sensitivity Level 1
• ESD Ratings: IEC61000−4−2 (Level 4)
Machine Model = C
Human Body Model = 3B
• This is a Pb−Free Device*
Benefits
• Reduces EMI/RFI Emissions on a Data Line
• Low Profile Package; Typical Height of 0.5 mm
• Design−Friendly and Easy−to−Use Pin Configurations,
Particularly for Portable Electronics
• Integrated Solution Offers Cost and Space Savings in UDFN Package
• Excellent S21 Characteristics with very Low Parasitic Inductances
• Integrated Solution Improves System Reliability
Applications
• EMI Filtering and ESD Protection for Data Lines
• Keypad Interface and Protection for Portable Electronics
• Bottom Connector Interface for Mobile Handsets
• Notebook Computers and Digital Cameras
• LCD Display Interface in Mobile Handsets
• Camera Display Interface in Mobile Handsets
http://onsemi.com
1
12
Cd Cd
2
11
Cd Cd
3
10
Cd Cd
4
9
Cd Cd
5
8
Cd Cd
6
7
Cd Cd
(Top View)
12
1
UDFN12
MU SUFFIX
CASE 517AE
MARKING
DIAGRAM
601M
G
1
601 = Specific Device Code
M
= Month Code
G
= Pb−Free Package
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
ORDERING INFORMATION
Device
Package
Shipping^†
NUF6001MUT2G UDFN12 3000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
1
July, 2006 − Rev. 0
Publication Order Number:
NUF6001MU/D