NUF4107FC_06 Datasheet, PDF (1/5 Pages) ON Semiconductor – Four Channel EMI Pi−Filter Array with Full USB Filter

NUF4107FC
Four Channel EMI Pi−Filter
Array with Full USB Filter
This device is a four−channel EMI filter array for data lines. Greater
than −35 dB attenuation is obtained at frequencies from 800 MHz to
2.2 GHz. It also offers USB filtering circuitry with speed detection.
This includes the inline resistors for impedance matching and EMI
filtering. ESD protection is provided across all capacitors.
Features
• EMI Filtering and ESD Protection for Data Lines
• USB 1.1 Filtering Provided with Speed Detection
• Integration of 27 Discretes Offers Cost and Space Savings
• 350 mm Solder Spheres
• All TVS Protected Inputs Comply with IEC61000−4−2 (Level 4)
30 kV (Contact)
30 kV (Air)
• Low Profile Flip−Chip Packaging
• MSL 1
• All Pins Exceed 2000 V Human Body Model (Note 1)
• Pb−Free Package is Available*
Typical Applications
• EMI and USB Filtering and ESD Protection for Data Lines
• Cell Phones
• Handheld Portables
• Notebook Computers
• MP3 Players
MAXIMUM RATINGS (T_A = 25°C)
Rating
Symbol
Value
Unit
ESD Discharge IEC61000−4−2 (Note 1) V_PP
− Air Discharge, Contact Discharge
Human Body Model
Machine Model
kV
30
16
0.4
DC Power per Resistor
DC Power per Package
Junction Temperature
Operating Temperature Range
Storage Temperature Range
P_R
100
mW
P_T
600
mW
T_J
150
°C
T_op
−40 to +85 °C
T_stg
−55 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. This does not include Pins B1, C1 and C2
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
1
March, 2006 − Rev. 3
http://onsemi.com
CIRCUIT DESCRIPTION
A1
D₁
R₁
C₁
C1
R₇
A2
D₂
R₂ B1
C₂
C2
D₁₁
A3
D₃
A4
D₅
A5
D₇
A6
D₉
B_{2 R3}
C₃ C₄
B_{3 R4}
C₅ C₆
B_{4 R5}
C₇ C₈
B_{5 R6}
C₉ C₁₀
C3
D₄
C4
D₆
C5
D₈
C6
D₁₀
FLIP−CHIP−17
CASE 499AD
A1
MARKING DIAGRAM
ÈÈ_{4107AYWW G}
4107
A
Y
= Device Code
= Assembly Location
= Year
G
WW = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
NUF4107FCT1 Flip−Chip 3000 Tape & Reel
NUF4107FCT1G Flip−Chip 3000 Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
NUF4107FC/D