NUF2441FC_10 Datasheet, PDF (1/3 Pages) ON Semiconductor – nullIntegrated Passive Filter

NUF2441FC
Integrated Passive Filter
with ESD Protection
This device is designed for cell phone applications requiring
Headset and Speaker Phone, EMI Filtering and ESD Protection.
This device offers an integrated solution in a small package reducing
PCB space and cost.
Features:
 Provides EMI Filtering and ESD Protection
 Single IC Offers Cost Savings by Replacing 2 Inductors,
4 Capacitors, and 4 TVs Diodes
 Compliance with IEC61000--4--2, (Level 4)
30 kV (Contact), 30 kV (air)
 Flip--Chip Package
 Moisture Sensitivity Level 1
 ESD Ratings: Machine Model = C
ESD Ratings: Human Body Model = 3B
 Pb--Free Package is Available*
Benefits:
 Flip--Chip Package Minimizes PCB Space
 Integrated Circuit Increases System Reliability versus Discrete
Component Implementation
 TVs Devices Provide ESD Protection That is Better than a Discrete
Implementation because the Small IC minimizes Parasitic
Inductances
Typical Applications:
 Cell Phones
 Communication Circuits
MAXIMUM RATINGS (T_A = 25C)
Rating
Symbol
Value
Unit
ESD Discharge IEC61000--4--2
V_pp
kV
Contact Discharge
30
Air Discharge
30
Operating Temperature Range
T_J
--40 to +125
C
Storage Temperature Range
T_stg
--55 to +150
C
Lead Solder Temperature
(10 second duration)
T_L
260
C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
http://onsemi.com
CIRCUIT DESCRIPTION
B2
C₁
L ^C2
B1
B3
A1
A3
C₁
L
C₂
A2
MARKING
DIAGRAM
A1
Flip--Chip
CASE 499J
2441AYWW
2441
A
Y
WW
= Specific Device Code
= Assembly Location
= Year
= Work Week
PIN CONFIGURATION
A1 B1
A2 B2
A3 B3
(Bump View)
ORDERING INFORMATION
Package
NUF2441FCT1
Device
Shipping^†
Flip--Chip 3000/Tape & Reel
NUF2441FCT1G Flip--Chip 3000/Tape & Reel
(Pb--Free)
*For additional information on our Pb--Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
 Semiconductor Components Industries, LLC, 2010
1
November, 2010 -- Rev. 5
Publication Order Number:
NUF2441FC/D