NTZD3154N Datasheet, PDF (1/5 Pages) ON Semiconductor – Small Signal MOSFET 20 V, 540 mA, Dual N−Channel

NTZD3154N
Small Signal MOSFET
20 V, 540 mA, Dual N−Channel
Features
• Low R_DS(on) Improving System Efficiency
• Low Threshold Voltage
• Small Footprint 1.6 x 1.6 mm
• ESD Protected Gate
• These are Pb−Free Devices
Applications
• Load/Power Switches
• Power Supply Converter Circuits
• Battery Management
• Cell Phones, Digital Cameras, PDAs, Pagers, etc.
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted.)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain Current
(Note 1)
Power Dissipation
(Note 1)
Steady ^{TA = 25°C}
State _{TA = 85°C}
Steady State
V_DSS
V_GS
I_D
P_D
20
V
±6.0 V
540 mA
390
250 mW
Continuous Drain Current
T_A = 25°C
(Note 1)
tv5s
T_A = 85°C
I_D
Power Dissipation
(Note 1)
tv5s
P_D
570 mA
410
280 mW
Pulsed Drain Current
t_p = 10 ms
Operating Junction and Storage Temperature
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
I_DM
T_J,
T_STG
I_S
T_L
1.5 A
−55 to °C
150
350 mA
260 °C
THERMAL RESISTANCE RATINGS
Parameter
Junction−to−Ambient – Steady State
(Note 1)
Junction−to−Ambient – t v 5 s (Note 1)
Symbol Max Unit
500 °C/W
R_qJA
447
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 in sq pad size
(Cu. area = 1.127 in sq [1 oz] including traces).
http://onsemi.com
V_(BR)DSS
20
R_DS(on) Typ
400 mW @ 4.5 V
500 mW @ 2.5 V
700 mW @ 1.8 V
I_D Max (Note 1)
540 mA
D1
D2
G1
G2
N−Channel
S1
MOSFET
S2
MARKING
DIAGRAM
6
1
SOT−563−6
CASE 463A
TV M G
G
TV
= Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
PINOUT: SOT−563
S₁ 1
6 D₁
G₁ 2
5 G₂
D₂ 3
4 S₂
Top View
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
1
March, 2006 − Rev. 1
Publication Order Number:
NTZD3154N/D