NTY100N10_06 Datasheet, PDF (1/8 Pages) ON Semiconductor – Power MOSFET 123 A, 100 V N−Channel Enhancement−Mode TO264 Package

NTY100N10
Preferred Device
Power MOSFET 123 A,
100 V N−Channel
Enhancement−Mode TO264
Package
Features
• Source−to−Drain Diode Recovery Time Comparable to a Discrete
Fast Recovery Diode
• Avalanche Energy Specified
• IDSS and R_DS(on) Specified at Elevated Temperature
• Pb−Free Package is Available*
Applications
• PWM Motor Control
• Power Supplies
• Converters
MAXIMUM RATINGS (T_C = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−Source Voltage
Drain−Gate Voltage (R_GS = 1 MW)
Gate−Source Voltage
− Continuous
− Non−Repetitive (t_p v 10 ms)
Drain Current (Note 1)
− Continuous @ T_C = 25°C
− Pulsed
Total Power Dissipation (Note 1)
Derate above 25°C
V_DSS
100
V
V_DGR 100
V
V_GS
V_GSM
I_D
I_DM
P_D
$ 20
$ 40
123
369
313
2.5
V
V
A
A
Watts
W/°C
Operating and Storage Temperature Range
T_J, T_stg −55 to °C
150
Single Pulse Drain−to−Source
Avalanche Energy − Starting T_J = 25°C
(V_DD = 80 Vdc, V_GS = 10 Vdc,
Peak I_L = 100 Apk, L = 0.1 mH, R_G = 25 W)
Thermal Resistance
− Junction to Case
− Junction to Ambient
Maximum Lead Temperature for Soldering
Purposes, 0.125 in from case for 10 seconds
E_AS
R_qJC
R_qJA
T_L
500 mJ
0.4 °C/W
25
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Pulse Test: Pulse Width = 10 ms, Duty−Cycle = 2%.
http://onsemi.com
123 A, 100 V
9 mW @ V_GS = 10 V (Typ)
N−Channel
D
G
S
MARKING DIAGRAM &
PIN ASSIGNMENT
1
23
TO−264
CASE 340G
STYLE 1
NTY100N10
AYYWWG
123
GDS
A
= Assembly Location
YY
= Year
WW = Work Week
G
= Pb−Free Package
ORDERING INFORMATION
Device
NTY100N10
Package
TO−264
Shipping
25 Units/Rail
NTY100N10G
TO−264
(Pb−Free)
25 Units/Rail
Preferred devices are recommended choices for future use
and best overall value.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference
Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
1
March, 2006 − Rev. 2
Publication Order Number:
NTY100N10/D