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NTTS2P03R2G Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET −2.48 Amps, −30 Volts | |||
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NTTS2P03R2
Power MOSFET
â2.48 Amps, â30 Volts
PâChannel Enhancement Mode
Single Micro8t Package
Features
⢠Ultra Low RDS(on)
⢠Higher Efficiency Extending Battery Life
⢠Miniature Micro8 Surface Mount Package
⢠Diode Exhibits High Speed, Soft Recovery
⢠Micro8 Mounting Information Provided
⢠PbâFree Package is Available
Applications
⢠Power Management in Portable and BatteryâPowered Products,
i.e.: Cellular and Cordless Telephones and PCMCIA Cards
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value Unit
DrainâtoâSource Voltage
GateâtoâSource Voltage â Continuous
Thermal Resistance,
JunctionâtoâAmbient (Note 1)
Total Power Dissipation @ TA = 25°C
Continuous Drain Current @ TA = 25°C
Continuous Drain Current @ TA = 70°C
VDSS
VGS
RqJA
PD
ID
ID
â30
V
"20
V
160
0.78
â2.48
â1.98
°C/W
W
A
A
Thermal Resistance,
JunctionâtoâAmbient (Note 2)
Total Power Dissipation @ TA = 25°C
Continuous Drain Current @ TA = 25°C
Continuous Drain Current @ TA = 70°C
RqJA
PD
ID
ID
70
1.78
â3.75
â3.0
°C/W
W
A
A
Thermal Resistance,
JunctionâtoâAmbient (Note 3)
Total Power Dissipation @ TA = 25°C
Continuous Drain Current @ TA = 25°C
Continuous Drain Current @ TA = 70°C
Pulsed Drain Current (Note 5)
Thermal Resistance ,
JunctionâtoâAmbient (Note 4)
Total Power Dissipation @ TA = 25°C
Continuous Drain Current @ TA = 25°C
Continuous Drain Current @ TA = 70°C
Pulsed Drain Current (Note 5)
Operating and Storage
Temperature Range
RqJA
PD
ID
ID
IDM
RqJA
PD
ID
ID
IDM
TJ, Tstg
210
0.60
â2.10
â1.67
â17
°C/W
W
A
A
A
100
1.25
â3.02
â2.42
â24
â55 to
+150
°C/W
W
A
A
A
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Minimum FRâ4 or Gâ10 PCB, Time ⤠10 Seconds.
2. Mounted onto a 2â³ square FRâ4 Board (1â³ sq. 2 oz Cu 0.06â³ thick single sided),
Time ⤠10 Seconds.
3. Minimum FRâ4 or Gâ10 PCB, Steady State.
4. Mounted onto a 2â³ square FRâ4 Board (1â³ sq. 2 oz Cu 0.06â³ thick single sided),
Steady State.
5. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2%.
© Semiconductor Components Industries, LLC, 2005
1
June, 2005 â Rev. 2
http://onsemi.com
â2.48 AMPERES
â30 VOLTS
85 mW @ VGS = â10 V
Single PâChannel
D
G
S
8
1
Micro8
CASE 846A
STYLE 1
MARKING DIAGRAM
& PIN ASSIGNMENT
Source
Source
Source
Gate
1
8
2
7
3
6
4
5
(Top View)
Drain
Drain
Drain
Drain
WW
= Work Week
AE
= Device Code
G
= PbâFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shippingâ
NTTS2P03R2
NTTS2P03R2G
Micro8
Micro8
(PbâFree)
4000/Tape & Reel
4000/Tape & Reel
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Publication Order Number:
NTTS2P03R2/D
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