NTTS2P02R2_06 Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET -2.4 Amps, -20 Volts

NTTS2P02R2
Power MOSFET
−2.4 Amps, −20 Volts
Single P−Channel Micro8t
Features
• Ultra Low R_DS(on)
• Higher Efficiency Extending Battery Life
• Logic Level Gate Drive
• Miniature Micro−8 Surface Mount Package
• Diode Exhibits High Speed, Soft Recovery
• Micro8 Mounting Information Provided
• Pb−Free Package is Available
Applications
• Power Management in Portable and Battery−Powered Products,
i.e.: Cellular and Cordless Telephones, and PCMCIA Cards
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Rating
Symbol Value
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Thermal Resistance −
Junction−to−Ambient (Note 1)
Total Power Dissipation @ T_A = 25°C
Continuous Drain Current @ T_A = 25°C
Continuous Drain Current @ T_A = 70°C
Pulsed Drain Current (Note 3)
Thermal Resistance −
Junction−to−Ambient (Note 2)
Total Power Dissipation @ T_A = 25°C
Continuous Drain Current @ T_A = 25°C
Continuous Drain Current @ T_A = 70°C
Pulsed Drain Current (Note 3)
Operating and Storage
Temperature Range
V_DSS
V_GS
−20
±8.0
R_qJA
P_D
I_D
I_D
I_DM
160
0.78
−2.4
−1.92
−20
R_qJA
P_D
I_D
I_D
I_DM
T_J, T_stg
88
1.42
−3.25
−2.6
−30
−55 to
+150
Single Pulse Drain−to−Source Avalanche
Energy − Starting T_J = 25°C
(V_DD = −20 Vdc, V_GS = −4.5 Vdc,
Peak I_L = −5.0 Apk, L = 28 mH,
R_G = 25 W)
Maximum Lead Temperature for Soldering
Purposes for 10 seconds
EAS
350
T_L
260
Unit
V
V
°C/W
W
A
A
A
°C/W
W
A
A
A
°C
mJ
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Minimum FR−4 or G−10 PCB, Steady State.
2. Mounted onto a 2″ square FR−4 Board
(1 IN SQ, 2 oz Cu 0.06″ thick single sided), Steady State.
3. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2%.
http://onsemi.com
−2.4 AMPERES
−20 VOLTS
R_DS(on) = 90 mW
Single P−Channel
D
G
S
MARKING DIAGRAM &
PIN ASSIGNMENT
DD DD
8
8
1
Micro8
CASE 846A
STYLE 1
WW
ADG
G
1
SS SG
AD
= Specific Device Code
WW = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping^†
NTTS2P02R2
Micro8 4000/Tape & Reel
NTTS2P02R2G Micro8 4000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
1
March, 2006 − Rev. 5
Publication Order Number:
NTTS2P02R2/D