NTTFS5820NL_11 Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET

NTTFS5820NL
Power MOSFET
60 V, 37 A, 11.5 mW
Features
• Low R_DS(on)
• Low Capacitance
• Optimized Gate Charge
• These Devices are Pb−Free and are RoHS Compliant
MAXIMUM RATINGS (T_J = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current R_qJA (Note 1)
T_A = 25°C
T_A = 100°C
Power Dissipation R_qJA
(Note 1)
Continuous Drain
Current R_qJC (Note 1)
Steady
State
T_A = 25°C
T_A = 100°C
T_C = 25°C
T_C = 100°C
Power Dissipation
R_qJC (Note 1)
T_C = 25°C
T_C = 100°C
Pulsed Drain Current
t_p = 10 ms
Operating Junction and Storage Temperature
V_DSS
V_GS
I_D
P_D
I_D
P_D
I_DM
T_J,
T_stg
60
V
±20 V
11
A
7
2.7 W
1.1
37
A
24
33 W
13
149 A
−55 to °C
+150
Source Current (Body Diode)
I_S
Single Pulse Drain−to−Source Ava- L = 0.1 mH E_AS
lanche Energy
I_AS
Lead Temperature for Soldering Purposes
T_L
(1/8” from case for 10 s)
37
A
48 mJ
31
A
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol
Value
Unit
Junction−to−Case – Steady
State (Note 1)
R_qJC
3.8
°C/W
Junction−to−Ambient – Steady
R_qJA
46.7
State (Note 1)
1. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces.
http://onsemi.com
V_(BR)DSS
60 V
R_DS(on) MAX
11.5 mW @ 10 V
15 mW @ 4.5 V
I_D MAX
37 A
N−Channel MOSFET
D (5−8)
G (4)
1
WDFN8
(m8FL)
CASE 511AB
S (1,2,3)
MARKING DIAGRAM
1
S
D
S
5820
D
S AYWWG D
G
G
D
5820
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping^†
NTTFS5820NLTAG WDFN8 1500 / Tape & Reel
(Pb−Free)
NTTFS5820NLTWG WDFN8 5000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
1
November, 2011 − Rev. 1
Publication Order Number:
NTTFS5820NL/D