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NTTFS4951N Datasheet, PDF (1/7 Pages) ON Semiconductor – Single N−Channel Power MOSFET
NTTFS4951N
Power MOSFET
30 V, 46 A, Single N−Channel, m8FL
Features
• Optimized for Portable Applications with 5 V Gate Drive
• Low RDS(on) to Minimize Conduction Losses
• Low Capacitance to Minimize Driver Losses
• Optimized Gate Charge to Minimize Switching Losses
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
• DC−DC Converters
• Power Load Switch
• Notebook Battery Management
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current RqJA (Note 1)
Power Dissipation RqJA
(Note 1)
VDSS
30
V
VGS
±20 V
TA = 25°C
ID
13.5 A
TA = 85°C
9.7
TA = 25°C
PD
2.19 W
Continuous Drain
Current RqJA ≤ 10 s
(Note 1)
TA = 25°C
ID
19
A
TA = 85°C
13.7
Power Dissipation
RqJA ≤ 10 s (Note 1)
Continuous Drain
Current RqJA (Note 2)
Steady
State
TA = 25°C
TA = 25°C
TA = 85°C
Power Dissipation
RqJA (Note 2)
TA = 25°C
Continuous Drain
Current RqJC (Note 1)
TC = 25°C
TC = 85°C
Power Dissipation
RqJC (Note 1)
TC = 25°C
Pulsed Drain Current
TA = 25°C, tp = 10 ms
Operating Junction and Storage Temperature
Source Current (Body Diode)
Drain to Source dV/dt
PD
ID
PD
ID
PD
IDM
TJ,
Tstg
IS
dV/dt
4.42 W
8.3
A
6.0
0.84 W
46
A
33
25.5 W
140
−55 to
+150
29
6.0
A
°C
A
V/ns
Single Pulse Drain−to−Source Avalanche Energy
EAS
(TJ = 25°C, VDD = 50 V, VGS = 10 V,
IL = 29 Apk, L = 0.1 mH, RG = 25 W)
Lead Temperature for Soldering Purposes
TL
(1/8″ from case for 10 s)
42 mJ
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Surface−mounted on FR4 board using 1 sq−in pad, 1 oz Cu.
2. Surface−mounted on FR4 board using the minimum recommended pad size.
http://onsemi.com
V(BR)DSS
30 V
RDS(on) MAX
6.2 mW @ 10 V
9.0 mW @ 4.5 V
ID MAX
46 A
N−Channel MOSFET
D (5−8)
G (4)
1
WDFN8
(m8FL)
CASE 511AB
S (1,2,3)
MARKING DIAGRAM
1
S
D
S
4951
D
S AYWWG D
G
G
D
4951
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
NTTFS4951NTAG WDFN8 1500/Tape & Reel
(Pb−Free)
NTTFS4951NTWG WDFN8 5000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2014
1
January, 2014 − Rev. 1
Publication Order Number:
NTTFS4951N/D