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NTTFS3A08P Datasheet, PDF (1/3 Pages) ON Semiconductor – Power MOSFET .20 V, .14 A, Single P.Channel, 8FL | |||
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NTTFS3A08P
Product Preview
Power MOSFET
â20 V, â14 A, Single PâChannel, m8FL
Features
⢠Ultra Low RDS(on) to Minimize Conduction Losses
⢠m8FL 3.3 x 3.3 x 0.8 mm for Space Saving and Excellent Thermal
Conduction
⢠ESD Protection Level of 5 kV per JESD22âA114
⢠These Devices are PbâFree, Halogen Free/BFR Free and are RoHS
Compliant
Applications
⢠Battery/Switch
⢠High Side Load Switch
⢠Optimized for Power Management Applications for Portable
Products such as Media Tablets, Ultrabook PCs and Cellphones
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
DrainâtoâSource Voltage
GateâtoâSource Voltage
Continuous Drain
Current RqJA (Note 1)
Power Dissipation RqJA
(Note 1)
TA = 25°C
TA = 85°C
TA = 25°C
VDSS
VGS
ID
PD
20
V
±8
V
â14 A
â10
2.2 W
Continuous Drain
TA = 25°C
ID
Current RqJA ⤠10 s
(Note 1)
Steady TA = 85°C
Power Dissipation
State
TA = 25°C
PD
RqJA ⤠10 s (Note 1)
â20 A
â15
4.5 W
Continuous Drain
Current RqJA (Note 2)
Power Dissipation
RqJA (Note 2)
TA = 25°C
ID
TA = 85°C
TA = 25°C
PD
â9
A
â6
0.84 W
Pulsed Drain Current
TA = 25°C, tp = 10 ms
IDM
â43 A
Operating Junction and Storage Temperature
TJ,
â55 to °C
Tstg
+150
ESD (HBM, JESD22âA114)
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8â³ from case for 10 s)
VESD
IS
TL
5000 V
â6
A
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surfaceâmounted on FR4 board using 1 sqâin pad, 1 oz Cu.
2. Surfaceâmounted on FR4 board using the minimum recommended pad size.
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
http://onsemi.com
V(BR)DSS
â20 V
RDS(on) MAX
6.7 mW @ â4.5 V
9.0 mW @ â2.5 V
ID MAX
â14 A
PâChannel MOSFET
G
D
1
WDFN8
(m8FL)
CASE 511AB
MARKING DIAGRAM
1
S
D
S
XXXX
D
S AYWWG D
G
G
D
XXXX
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= PbâFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shippingâ
NTTFS3A08PTAG WDFN8 1500 / Tape &
(PbâFree)
Reel
NTTFS3A08PTWG WDFN8 1500 / Tape &
(PbâFree)
Reel
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2012
1
June, 2012 â Rev. P0
Publication Order Number:
NTTFS3A08P/D
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