NTTD2P02R2 Datasheet, PDF (1/8 Pages) ON Semiconductor – Power MOSFET Dual P−Channel Micro8

NTTD2P02R2
Power MOSFET
−2.4 Amps, −20 Volts
Dual P−Channel Micro8
Features
• Ultra Low R_DS(on)
• Higher Efficiency Extending Battery Life
• Logic Level Gate Drive
• Miniature Micro−8 Surface Mount Package
• Diode Exhibits High Speed, Soft Recovery
• Micro8 Mounting Information Provided
Applications
• Power Management in Portable and Battery−Powered Products, i.e.:
Cellular and Cordless Telephones and PCMCIA Cards
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Thermal Resistance −
Junction−to−Ambient (Note 1.)
Total Power Dissipation @ T_A = 25°C
Continuous Drain Current @ T_A = 25°C
Continuous Drain Current @ T_A = 70°C
Pulsed Drain Current (Note 3.)
Thermal Resistance −
Junction−to−Ambient (Note 2.)
Total Power Dissipation @ T_A = 25°C
Continuous Drain Current @ T_A = 25°C
Continuous Drain Current @ T_A = 70°C
Pulsed Drain Current (Note 3.)
Operating and Storage
Temperature Range
V_DSS
V_GS
R_θJA
P_D
I_D
I_D
I_DM
R_θJA
P_D
I_D
I_D
I_DM
T_J, T_stg
−20
V
"8.0
V
160
0.78
−2.4
−1.92
−20
°C/W
W
A
A
A
88
1.42
−3.25
−2.6
−30
−55 to
+150
°C/W
W
A
A
A
°C
Single Pulse Drain−to−Source Avalanche
E_AS
Energy − Starting T_J = 25°C
(V_DD = −20 Vdc, V_GS = −4.5 Vdc,
Peak I_L = −5.0 Apk, L = 28 mH,
R_G = 25 Ω)
Maximum Lead Temperature for Soldering
T_L
Purposes for 10 seconds
350
mJ
260
°C
1. Minimum FR−4 or G−10 PCB, Steady State.
2. Mounted onto a 2″ square FR−4 Board (1″ sq. 2 oz Cu 0.06″ thick single
sided), Steady State.
3. Pulse Test: Pulse Width  300 ms, Duty Cycle  2%.
http://onsemi.com
−2.4 AMPERES
−20 VOLTS
R_DS(on) = 90 mW
P−Channel
D
G
8
1
Micro8
CASE 846A
STYLE 2
S
MARKING
DIAGRAM
YWW
BE
Y
= Year
WW = Work Week
BE
= Device Code
PIN ASSIGNMENT
Source 1
Gate 1
Source 2
Gate 2
18
2
7
3
6
4
5
Top View
Drain 1
Drain 1
Drain 2
Drain 2
ORDERING INFORMATION
Device
Package
Shipping
NTTD2P02R2 Micro8 4000/Tape & Reel
© Semiconductor Components Industries, LLC, 2006
1
August, 2006 − Rev. 1
Publication Order Number:
NTTD2P02R2/D