NTTD1P02R2 Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET -1.45 Amps, -20 Volts

NTTD1P02R2
Power MOSFET
−1.45 Amps, −20 Volts
P−Channel Enhancement Mode
Dual Micro8 Package
Features
• Ultra Low R_DS(on)
• Higher Efficiency Extending Battery Life
• Logic Level Gate Drive
• Miniature Dual Micro8 Surface Mount Package
• Diode Exhibits High Speed, Soft Recovery
• Micro8 Mounting Information Provided
Applications
• Power Management in Portable and Battery−Powered Products, i.e.:
Computers, Printers, PCMCIA Cards, Cellular and Cordless
Telephones
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Thermal Resistance −
Junction−to−Ambient (Note 1.)
Total Power Dissipation @ T_A = 25°C
Continuous Drain Current @ T_A = 25°C
Continuous Drain Current @ T_A = 70°C
Pulsed Drain Current (Note 3.)
Thermal Resistance −
Junction−to−Ambient (Note 2.)
Total Power Dissipation @ T_A = 25°C
Continuous Drain Current @ T_A = 25°C
Continuous Drain Current @ T_A = 70°C
Pulsed Drain Current (Note 3.)
Operating and Storage
Temperature Range
V_DSS
V_GS
R_θJA
P_D
I_D
I_D
I_DM
R_θJA
P_D
I_D
I_D
I_DM
T_J, T_stg
−20
V
"8.0
V
250
0.50
−1.45
−1.15
−10
°C/W
W
A
A
A
125
1.0
−2.04
−1.64
−16
−55 to
+150
°C/W
W
A
A
A
°C
Single Pulse Drain−to−Source Avalanche
E_AS
Energy − Starting T_J = 25°C
(V_DD = −20 Vdc, V_GS = −4.5 Vdc,
Peak I_L = −3.5 Apk, L = 5.6 mH,
R_G = 25 Ω)
Maximum Lead Temperature for Soldering
T_L
Purposes for 10 seconds
35
mJ
260
°C
1. Minimum FR−4 or G−10 PCB, Steady State.
2. Mounted onto a 2″ square FR−4 Board (1″ sq. 2 oz Cu 0.06″ thick single
sided), Steady State.
3. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2%.
http://onsemi.com
−1.45 AMPERES
−20 VOLTS
160 mW @ V_GS = −4.5
Dual P−Channel
D
G
S
8
1
Micro8
CASE 846A
STYLE 2
MARKING DIAGRAM
& PIN ASSIGNMENT
Source 1
Gate 1
Source 2
Gate 2
1
8
2
3
4
YWW
BC
7
6
5
Drain 1
Drain 1
Drain 2
Drain 2
(Top View)
Y = Year
WW = Work Week
BC = Device Code
ORDERING INFORMATION
Device
Package
Shipping^†
NTTD1P02R2 Micro8 4000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2003
1
December, 2003 − Rev. 1
Publication Order Number:
NTTD1P02R2/D