NTS4173P Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET −30 V, −1.3 A, Single P−Channel, SC−70

NTS4173P
Power MOSFET
−30 V, −1.3 A, Single P−Channel, SC−70
Features
• −30 V BV_ds, Low R_DS(on) in SC−70 Package
• Low Threshold Voltage
• Fast Switching Speed
• This is a Halide−Free Device
• This is a Pb−Free Device
Applications
• Load Switch
• Low Current Inverter and DC−DC Converters
• Power Switch for Printers, Communication Equipment
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
−30
V
Gate−to−Source Voltage
V_GS
±12
V
Continuous Drain
Current (Note 1)
Steady ^{TA = 25°C}
State _{TA = 85°C}
I_D
−1.2
−0.80 A
t ≤ 5 s T_A = 25°C
−1.3
Power Dissipation
(Note 1)
Steady
State
T_A = 25°C
P_D
t≤5s
0.29
W
0.35
Pulsed Drain Current
t_p = 10 ms
Operating Junction and Storage Temperature
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
I_DM
−5.0
A
T_J,
T_stg
−55 to
150
°C
I_S
−1.0
A
T_L
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL RESISTANCE RATINGS
Parameter
Symbol Max Unit
Junction−to−Ambient − Steady State (Note 1)
R_qJA
425 °C/W
Junction−to−Ambient − t ≤ 5 s (Note 1)
R_qJA
360
1. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces)
http://onsemi.com
V_(BR)DSS
−30 V
R_DS(on) MAX
150 mW @ −10 V
200 mW @ −4.5 V
280 mW @ −2.5 V
I_D MAX
−1.2 A
−1.0 A
−0.9 A
SC−70/SOT−323 (3 LEADS)
S
G
D
3
MARKING DIAGRAM/
PIN ASSIGNMENT
1
2
SC−70/SOT−323
CASE 419
STYLE 8
3 Drain
TGMG
G
1
Gate
2
Source
TG
= Specific Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
NTS4173PT1G
Package
SC−70
(Pb−Free)
Shipping^†
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
* Date code orientation may vary depending upon
manufacturing location
© Semiconductor Components Industries, LLC, 2008
1
September, 2008 − Rev. 0
Publication Order Number:
NTS4173P/D